- Immunity to detrimental fretting due to shock and vibration
- Conforms to MIL-DTL-55302 general requirements and TPR 02013
- Light weight connector
- High shock and vibration proof (no micro interruptions - test: 2ns)
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KMC Series
High-density board to board and board to wire interconnect solutions available in multiple configurations from 26 to 162 positions with a 0.5mm contact diameter and is widely used in harsh environments.
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MDD Series
The MDD is a metal shell connector available with a 100 and 200 signal contacts configuration. With a 0.5mm contact diameter, with straight, surface mount tail and 90° termination styles. The metal shell improves system reliability by ensuring high levels of shock and vibration and by eliminating contact fretting, hence reducing wear rates, and avoiding system failure and down-times.
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HPH Series
HPH is suitable for the most demanding Commercial Aerospace, Defense and Industrial applications.
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C9394 Series
Available in 132 through 594 positions, that can be configured to include fiber optic and coax options.
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Rethinking Blind Mate Connectors to Increase Reliability in Miniaturized Electronics Assembly
Creating more compact electronic components with higher functionality is a challenge for all electronics manufacturers. Whatever industry you're in, creating consumer, business, or military-grade electronics, the challenge presents itself, and the stakes are high. As electronics are expected to continue shrinking while increasing capabilities, blind mating connectors are required to meet those same size and functionality requirements.
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Smiths Interconnect awards top distributors for 2022
The distribution award initiative recognizes and celebrates the business partners whose efforts have contributed to advancing Smiths Interconnect’s business respectively in the Americas, EMEA and Asia. Winners were selected as best performing distributors in terms of sales growth compared to the previous year.
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Accelerating Device Bring-Up and Production Ramp for WLCSP 5G Mobile IC’s
As mobile phone electronics continue to shrink, WLCSP has become the de-facto packaging solution for IC’s going into today’s flagship handsets. Manufacturers need solutions to rapidly debug their new silicon, and quickly ramp it to HVM while achieving aggressive DPPB quality levels.
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Smiths Interconnect honored as Outstanding Test and Measurement Company of the Year at the China IC Achievement Award
Smiths Interconnect, a leading provider of innovative test solutions for the semiconductor industry, won the China IC achievement award as the Outstanding Test and Measurement Company of the Year for its continuous innovation and rapid growth in the Chinese market.