D-Series H-Pin Socket | Smiths Interconnect

D Series H-Pin® Socket

D-Series H-Pin^® Socket is a performance burn-in socket, with a clamshell-style lid that can be equipped with a heater and thermal sensor. The D-Series line shares the same configurable features as other socket series in the Smiths Interconnect burn-in test portfolio. Leveraging H-Pin technology the D-Series line provides market-leading electrical performance, for high-speed burn-in applications.

Notice to California Residents: PROPOSITION 65 WARNING Click Here for details.
To find out if part number(s) meet regulatory substance or materials compliance (e.g., REACH, RoHS, or any other regulatory requirement) for compliance verification.

Design flexibility, in-house tooling and molds allow for the lowest cost of test.
Extensive catalog of components andconfigurable options
Proven track record of reducing the cost of test leveraging modular components, automated assembly, and short lead times.
Exceptional electrical performance providing wide RF bandwidth

Feature options

For QFN,QFP,LCC, SOIC, BGA, and LGA spring loaded plunger
Heat sink
HAST venting features
Integrated thermal control with heater and sensor.
Reverse seating plane
High temperature materials for above 200 °C applications

Accelerating Device Bring-Up and Production Ramp for WLCSP 5G Mobile IC’s

As mobile phone electronics continue to shrink, WLCSP has become the de-facto packaging solution for IC’s going into today’s flagship handsets. Manufacturers need solutions to rapidly debug their new silicon, and quickly ramp it to HVM while achieving aggressive DPPB quality levels.
DaVinci 45G Portfolio Extension

The new 0.65mm pitch coaxial socket provides reliable and superior performance
Smiths Interconnect announces breakthrough contact technology of Kepler test socket

Whether for testing high performance computing, wearables or other automotive chips, Kepler is the only solution that provides two-axis of motion during a single actuation of the socket, an innovation set to pioneer the semiconductor test industry.
Challenges Semiconductor Package Size and Pitch Face in Shrinking Consumer Electronics

Tiny computers, smartphones, and small electronic devices that industry leaders and other companies have popularized are forcing the hand of semiconductor package designers to shrink the package to fit within these little hand-held gadgets. The demand for technology applications, such as smart homes, smart manufacturing, smart medical care, and automotive electronics, continues to increase. At the same time, the requirements of continuous miniaturization and functional diversification of electronic product demands also increase.