Skip to content

Transformer Series

HeavyPower & EasyPower

Transformer Series offers a customer configurable architecture, with just a few piece parts to create several types of connectors as a platform solution. No special tools are needed except crimping tools, resulting in a reduced stock and kitting/logistic management. The series offers a high reliability due to the Tortac® contact and provides up to 500 mating cycles and high current rating up to 300A/500A. 

Download Brochure

Features & Benefits

  • High density modular solution;
  • High power, up to 300A / 500A
  • Straight, angled and shunt termination styles;
  • Cable section size from 25mm² to 50mm² / 240mm²
  • Compliant with the EN45545- 2; (HL3 for R22 & R23

Overview

The HeavyPower and EasyPower Connectors are part of the Smiths Interconnect's Transformer range, a comprehensive series of high density, high power, heavy duty, modular connectors for all on-board power applications within the rail market. The Transformer's modularity enables customers to design their own solution by supplying the elementary components of the whole connector. It employs a unique do-it-yourself system based on the building block principle. The connectors are suitable for any applications requiring the transmission of very high currents such as power distribution, intercoaches and bogies.

The HeavyPower Series is available in 1 to 4 pole versions, supporting up to 300A per pole and a voltage rating of 3600V. The HeavyPower connector is offered with straight termination, that allows for the easy mounting on the roof or under the car's floor or with right angle termination to facilitate the mounting between two cars. As a variant, the HeavyPower Y Series is also proposed as a branch connector acting as a junction box.

The EasyPower Series is available in 1 to 4 pole versions, supporting up to 500A per pole and a voltage rating of 3600V. The EasyPower connectors can be supplied in a straight version, that allows for the easy mounting on the roof or under the car's floor. A straight version with a shunt is also available to facilitate mounting between two cars.

Documents & Literature

Related Products

  • Image of HyperMod Series

    HyperMod Series

    Hypermod mixes signal, power, and coaxial and high speed contacts. The IP67 rugged metallic shell makes the Hypermod connector resistant to shock and vibrations.

Related News

  • Widget Image ALT

    New Volta 180 supports Wafer Level Packages and Known Good Dies test businesses

    The new Volta 180 Series is an advanced WLCSP test solution that expands Volta product line to include the compact 180um pitch, allowing for a higher number of chips to be tested on each wafer. It allows for a fast and reliable testing of wafers to ensure that they meet specifications and perform as they should, which translates into higher quality end products.

  • Image of Raising the Bar of Burn-In Testing Sockets

    Raising the Bar of Burn-In Testing Sockets

    Burn-in testingĀ is widely used as an aid in producing failure-free electronic components. When scientifically planned and conducted, burn-in-testing sockets offer one of the most effective methods of reliability screening at the component level. Testing during production plays a vital role in ensuring reliability and repeatability. Semiconductor manufacturing plants perform tests at each stage of production to eliminate defective parts as early as possible while precisely controlling each process parameter of the chip.

  • Image of Challenges Semiconductor Package Size and Pitch Face in Shrinking Consumer Electronics

    Challenges Semiconductor Package Size and Pitch Face in Shrinking Consumer Electronics

    Tiny computers, smartphones, and small electronic devices that industry leaders and other companies have popularized are forcing the hand of semiconductor package designers to shrink the package to fit within these little hand-held gadgets. The demand for technology applications, such as smart homes, smart manufacturing, smart medical care, and automotive electronics, continues to increase. At the same time, the requirements of continuous miniaturization and functional diversification of electronic product demands also increase.