- Low loss, low back reflection
- General use design (no strain relief backshell needed)
- Optical disconnect style available: Standard 1.25 mm ferrule and sleeve
- Cable termination identical to LC connector process
- Easy cleaning access to the contact through removable alignment sleeve holder
- Standard ARINC 600 Size 16 insertion/removal tool
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DIN Contacts
Features of the Fiber optic DIN contacts are: twist protection pin, Multimode applications, Screw lock mechanism, Low insertion loss -0.20dB (typically)
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Accelerating Device Bring-Up and Production Ramp for WLCSP 5G Mobile IC’s
As mobile phone electronics continue to shrink, WLCSP has become the de-facto packaging solution for IC’s going into today’s flagship handsets. Manufacturers need solutions to rapidly debug their new silicon, and quickly ramp it to HVM while achieving aggressive DPPB quality levels.
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Smiths Interconnect expands DaVinci test socket offering
The request for increased functionality in the smallest possible footprint has led to a reduction of the pitch of integrated circuits below 500 μm. At the same time, increased performances in SoCs affect pin-to-pin noise or what is commonly called crosstalk during testing.
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Enhancing Customer Efficiency with Volta 200
New Volta 200 Series Offers Easy Maintenance of Spring Probe Technology for Finest Pitch Wafer Test
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Smiths Interconnect announces breakthrough contact technology of Kepler test socket
Whether for testing high performance computing, wearables or other automotive chips, Kepler is the only solution that provides two-axis of motion during a single actuation of the socket, an innovation set to pioneer the semiconductor test industry.