Resources
Smiths Interconnect has consistently stood at the forefront of innovation, offering a wealth of knowledge and expertise to the Semiconductor industry for over 40 years. Browse through our repository of educational resources, including white papers, blogs, webinars, and literature. These resources not only showcase our deep understanding of complex technological challenges but also serve as valuable tools for industry professionals, seeking to expand their knowledge and stay abreast of the latest trends and developments.
Documentation
Case Studies
This collection of case studies delves deep into the pivotal role played by Smiths Interconnect in the semiconductor sector. Through real-world examples, we illustrate how our advanced interconnect solutions, precision components, and state-of-the-art technology have not only met but exceeded the exacting demands of the semiconductor industry.
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Increasing Digital Reliability
Smiths Interconnect’s Solution: Volta Series Probe Heads
Products
Our product portfolio is meticulously designed to address these challenges, providing critical interconnect solutions and precision components that meet the exacting standards of the semiconductor test market. From high-frequency test sockets and customized test fixtures to advanced RF and microwave components, our offerings are engineered to support the reliable and precise testing of semiconductor devices.
Applications
Test socket and probe card solutions with spring probe contact technology to ensure superior quality and reliability in semiconductor test applications. Proven off-the-shelf and custom products deliver the best solutions for the customer’s specific requirements.
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Area Array Test
GPU
CPU
Artificial Intelligence
Deep Learning
High-speed Memory
Analog RF
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Package On Package Test
Smart Phone CPU
Wearable Technology
NFC - Near Field Communications
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Wafer Level Test
Bluetooth
Wi-Fi
Power Management
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Peripheral Package Test
Wireless Communications
Infotainment
Automotive
Industrial
Proliferation of data devices and the growth of cloud computing, artificial intelligence and big data is resulting in complex systems and new materials that require rigorous, efficient validation. Smiths Interconnect’s test sockets and probe card solutions ensure superior quality and reliability in the semiconductor test applications. Our best-in-class engineering, development and technical expertise ensure support of automated, system level and development test platforms for area array, peripheral, wafer level and Package on Package (PoP) devices as well as high performance spring probe technology and cable assemblies.
Test Solutions
We provide our customers with a competitive advantage when tackling the challenges of higher power, increased data rates, wider bandwidth, and greater connectivity all within a smaller footprint.Latest News
Smiths Interconnect expands into burn-in test market with acquisition of Plastronics
Learn MoreIncreasing Digital Reliability
As computers, mobiles and smart devices become more advanced, so must the integrated chips that support them. Smiths Interconnect’s new Volta semiconductor test solutions, are leading the way. These solutions are used for testing the integrated chip packages behind everything from Bluetooth and power management to digital displays. Volta significantly outperforms the competition in both durability and performance. Learn More-
Smiths expands US manufacturing of chip testers, after trade restrictions
Smiths said it had been investing several million pounds in additional equipment and staffing for an existing factory in the Texas city of Irving
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Smiths Interconnect launches ‘DaVinci Gen V’ next-generation test socket
The DaVinci Gen V solves the fundamental industry challenges of impedance tuning – an essential part of circuit design that enables maximum transfer of signal power – and signal integrity – the measurement of quality of an electrical signal as it travels through a circuit.
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Smiths Interconnect Wins Emerging Technology Award for DaVinci High-Speed IC Test Socket
DaVinci High-Speed integrated circuit (IC) Test Socket Technology wins 'Emerging Technology of the Year' at the Institution of Engineering and Technology (IET) Excellence and Innovation Awards in Birmingham, UK.