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Global Capabilities

Smiths Interconnect’s in-house capabilities encompass design, development, manufacturing, and testing to respond quickly and accurately to customers’ needs and provide the most reliable connectivity solutions.

Engineering Capabilities


  • 3D EM Modelling
  • Advanced RF & System Modelling
  • CAD/CAM & Solid Modelling
  • Finite Element Analysis
    • Thermal Analysis
    • Shock & Vibration Analysis
  • Reliability Analysis
Manufacturing Capabilities


  • Precision Machine Shops
  • Connector, Contact, & Cable Assembly
  • Automated PCB Assembly & Inspection
  • Automated Hybrid Assembly
    • Die Placement
    • Wedge & Wire Bonding
    • Gap Welding
  • NASA-Certified Soldering
  • Automated Test & Tune
  • System Integration
  • Validation Testing


  • CNC turning and milling centers
  • Cabling / Prototype Assembly
  • 3D Printing
  • Ceramic Grinding
  • EDM
  • Circuit Board Routing
Testing Capabilities


  • Electrical Acceptance & LOT Test
  • RF Testing Capabilities up to 325 GHz
  • High Speed Digital
  • Anechoic Chamber Testing
  • ESS Environmental Qualification
  • ESS Temperature, Shock & Vibration
  • Metallurgical
  • Real-Time X-Ray
  • Near Field /Compact Antenna Range
  • Thermal Vacuum
  • High Power RF Testing

Qualification Test Lab

The Dundee facility can now replicate deep space in terms of vacuum and heat with high power amplifiers and vacuum systems. It can therefore analyse high power devices that are used in space with regards to their breakdown voltage behaviour in a vacuum or near-vacuum environment. This effect, called multipaction, can render a device useless and, thus degrades the reliability of the satellite.Being able to offer multipaction testing is a major benefit and a real point of competitive differentiation but is also a game changer for Smiths Interconnect.