NEWS Nov 30 2020 New Volta 180 supports Wafer Level Packages and Known Good Dies test businesses The new Volta 180 Series is an advanced WLCSP test solution that expands Volta product line to include the compact 180um pitch, allowing for a higher number of chips to be tested on each wafer. It allows for a fast and reliable testing of wafers to ensure that they meet specifications and perform as they should, which translates into higher quality end products.
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Jun 27 2019 Smiths Interconnect Inc. Receives... Tampa, US –Smiths Interconnect, Inc. proudly announces receipt of the James S. Cogswell...
May 28 2019 Collaboration with Lockheed Martin on... Working with Lockheed Martin, prime contractor to NASA for Orion, Smiths Interconnect is among...
May 27 2019 Expansion of space-qualified products... Expanded range of space-qualified products used in LEO constellations and GEO high-throughput...
May 13 2019 LightCONEX 120 Gbps 24-lane to power... LightCONEX™ LC 120G (12TRX), the first 120 Gbps blind mate optical interconnect, will power a new...
Apr 30 2019 D Series Connector for Autoclaved... Smiths Interconnect D Series connectors are a high reliability alternative to premium priced...
Mar 20 2019 Genoa facility celebrates 60 Years On March 7th Smiths Interconnect celebrated 60 years of activity at its Genoa site during a...