Tim Wooden Product Line Manager Semiconductor Test Tim is an expert in semiconductor package test, with deep experience in the design, deployment, and application of advanced test socket solutions, System Level, RF Testing, PoP, SoC, High Power, Thermal and Fine Pitch. With specific expertise in Technical Sales, Product Development, Marketing and Business Development
Steven Davis Senior Field Applications Engineer Steven Davis is a Senior Field Applications Engineer with 11 years of experience in the role. He started his career as a Mechanical Design Engineer and has been with Smiths Interconnect over 16 years, gaining broad experience in providing professional contributirons to the company's product lines. Steven has a comprehensive and thorough understanding of the technical drivers that impact the electro-mechanical interface performance in test applications. Steven has designed, qualified and supported customer applications for all phases of the test process from bench and hand test, to high volume production.