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Integrated test solutions for 5G, data centers, and high-speed test applications

Now Available on Demand

The rapid expansion of connected devices and data-intensive applications is driving the growing demand for highly efficient and adaptive high-performance computing solutions. Mobile devices such as cell phones, tablets and car infotainment systems have the most sophisticated System-on-Chip (SoCs) ever produced. Testing these devices in full functionality requires comprehensive understanding of the impact the interconnect has on the signal path to address high speed signaling and critical device power requirements. Beyond these requirements, how to ensure these SoCs to function with exceptional reliability and accuracy?

This presentation will walk you through how Smiths Interconnect’s high performance test solution helps to accomplish two goals:
  • Provide an integrated test solution to meet the required device specification, so the products full functionality can be tested. 
  • Ensure an out-of-the-box solution for high yield production testing to meet time-to-market pressures

Key Takeaways

  • High speed test challenges overview 
  • Highlights of high speed test sockets series and how they meet the most demanding power/performance requirements for smart applications, including wearables, data centers and autonomous vehicles      

Presented By


Tim Wooden

Product Line Manager Semiconductor Test

Tim is an expert in semiconductor package test, with deep experience in the design, deployment, and application of advanced test socket solutions, System Level, RF Testing, PoP, SoC, High Power, Thermal and Fine Pitch. With specific expertise in Technical Sales, Product Development, Marketing and Business Development


Steven Davis

Senior Field Applications Engineer

Steven Davis is a Senior Field Applications Engineer with 11 years of experience in the role. He started his career as a Mechanical Design Engineer and has been with Smiths Interconnect over 16 years, gaining broad experience in providing professional contributirons to the company's product lines. Steven has a comprehensive and thorough understanding of the technical drivers that impact the electro-mechanical interface performance in test applications. Steven has designed, qualified and supported customer applications for all phases of the test process from bench and hand test, to high volume production.

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