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Space-saving and Cost-effective Chip Attenuators with Excellent Broadband Performance and High Power

Thursday, April 7th

On Demand

Sponsored by: RFMW and Smiths Interconnect


Abstract:

The acceleration of demand for communication and data transmission in the digital age is creating a huge market for broadband connectivity. Higher power ratings and broadband performance are needed to support a wide range of applications.

The new TSX Series is designed to offer excellent broadband performance up to 50 GHz, while delivering increased power handling in a small 0604 surface mount package. It allows wider coverage than traditional components while providing optimized return loss for multiple frequency ranges. This allows the customer to use a single chip in multiple applications, reducing the Bill of Material (BOM) item count and consequently, the cost of ownership.
 

Presented By

Presenter

Dave Raymond

Global Product Manager Board Level Devices, Fiber Optics and RF Components

Dave has responsibility over passive RF components including Thermopad®, Diamond RF ResistivesTM, Attenuators, Resistors, Terminations and HybrixTM signal processing components. In his 33 years of experience with Smiths he has covered different roles and has spent the last 15 years supporting customers in the space, defense, medical, commercial communications and industrial segments.
 

Presenter

Tim Meehan

Technical Application Engineer Resitive/Cables, Fiber Optics and RF Components

Tim has spent 25 years with Smiths Interconnect supporting the passive RF components line including Thermopad®, Diamond RF ResistivesTM, Attenuators, Terminations and Cable Assemblies. He has served in multiple roles supporting customers working in the space, defense, medical, commercial communication and industrial segments.

Thursday, April 7th

On Demand

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