IWLPC - International Wafer Level Packaging
October 22 - 23, 2019
DoubleTree by Hilton San Jose
San Jose, California, USA
SMTA and Chip Scale Review are pleased to announce the 16th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing.