Challenges RF Cables Face in the Space Market RF Semi-Rigid Cable AssembliesSpace Jan 25 2021 Join us Monday, January 25 11:00 am -11:45 EST Today’s RF cable assembly manufacturers are developing high-reliability integrated assemblies and harnesses to suit a variety of space applications and missions. Designing and manufacturing RF cable assemblies and harnesses involves a number of challenges. Join our webinar on Monday January 25th 11am EST to learn from our industry experts Product Market Director, Michael Carlson and Product Line Manager, Andrew Breslin as they share RF cable assembly challenges focused on radiation harden materials, cable routing, cable modularity, shielding effectiveness and lowering cost of ownership. By attending this webinar, you can expect to come away understanding the benefits of semi-rigid cables in space applications including: Seamless outer conductors for radiation resistance and shielding effectiveness Phase stable materials and phase matched cable assemblies Outer conductor material choices to alleviate pain points related to installation and cable routing. Presented by Michael Carlson Global Product Market Director, Space and Defense Michael is responsible for interpreting all key market trends, developing strategies and providing direction into product line development, product and technology roadmap creation and penetration into key and target accounts. Michael earned a BS degree in Electrical Engineering from Cal Poly University and a MBA from Chapman University. He has over 30 years of industry experience in interconnect and system level technology including product design, product management, global sales and market segment management. Andrew Breslin Product Line Manager, Data Interconnects Andy is responsible for developing product line strategy, leading go to market activity for the data products, and P&L responsibilities for the product line. Andy has been with Smiths Interconnect for 8 years. Share this article Share on Facebook Share on Twitter Share on LinkedIn Share via Email