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These sockets offer a modular design in a small outline with very low inductance. The new Open Top QFN socket allows for more convenient package loading and unloading in most of the same lead count options as the lidded version.
The Kepler contact technology combines the scrub motion of a cantilever contact with the versatility and modularity of a spring probe.
ES family Series of sockets extended the scope of a burn-in socket. The modular lid construction can handle up to 1 kW of power and is optimized with thermal simulation to ensure out-of-the-box performance whether liquid or air cooled.
ESJ Series socket is a high-performance burn-in socket, with dual latch clamshell lid to provide co-planar pressure on the DUT when the lid is actuated.
Galileo is an innovative, low-profile test socket that provides outstanding electrical and mechanical performance for IC test customers who need a cost effective, rapid delivery solution. Combining a universal interconnect fabric material with advanced 3D manufacturing processes, Galileo enables low-volume, rapid turn-around-time production of test sockets for a wide variety of IC test applications.
C Series Socket is a modular burn-in socket with clamshell-style lid. The small footprint outline allows for a best-in-class range of package accommodations, from 0.5 mm body size up to 12 mm and optimal socket density per burn-in board.
D-Series Socket is a performance burn-in socket, with a clamshell-style lid that can be equipped with a heater and thermal sensor.
ES Micro Series Socket is a technological advancement in the burn-in socket segment, with a dual latch clamshell lid to provide co-planar pressure on the DUT when the lid is actuated. The inclusion of the patented H-Pin contact technology in the ES Micro-Series socket provides market-leading electrical performance in the smallest footprint for the highest possible parallelism on a burn-in board. This series is compatible with standard heaters and temperature sensors.
The H-Pin is a stamped spring probe with the mechanical, electrical, and thermal performance of a spring probe, and the ease of use and high volume manufacturability of a stamped contact. The H-Pin serves applications without the typical compromises that are generally required when considering cost versus performance.
Smiths Interconnect is a leading provider of technically differentiated electronic components, subsystems, microwave and radio frequency products that connect, protect and control critical applications in the commercial aviation, defense, space, medical, rail, semiconductor test, wireless telecommunications, and industrial markets.