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We provide solutions across a wide range or markets.
From the production floor to outdoor usage to air-frame environments, Smiths Interconnect has options that will allow your cable assemblies to maintain their performance by increasing the assembly durability and ruggedness to a level required in many extreme terrestrial environments for mission critical applications.
Highly precised top and bottom array simultaneous test capable socket for effective package on package test. Customized socket design is capable to test high speed signals in lab, engineering, SLT and ATE applications. Controlled impedance loop-back with PCB for high speed signal integrity.
IC developers are increasingly integrating functionalities within a single package, escalating the complexity of test. Higher speed digital and analog devices are being manufactured at record volumes and the need for high performance testing has never been greater. The DaVinci Series Test Socket is a high performance coaxial socket developed for reliable IC testing up to 67GHz Analog RF & 56Gbps NRZ Digital, a patented design integrating spring probe technology and a proprietary insulated housing material.
Customized test sockets for any IC packages. Suitable for lab, Engineering, SLT & ATE test application. Wide selection of Smiths Interconnects spring pins with low and stable contact resistance. World class design, Lab and manufacturing facility to ensure consistence product performance with highest customer satisfaction. Highly competitive price and global support.
Highly reliable multi site strip test socket . Customized design to suite any strip test handler. High parallelism offers higher throughput.
5A continues current carrying capacity and capable -50 to 170deg C test environment. Proprietary contact design with wiping action at device pad to ensure consistent contact resistance. Minimal scrub action to the PCB pad.
Extremely short signal path and capable to handle >40GHz. Customized test socket design for lab, engineering, SLT and ATE tests.
Proprietary embedded barrel spring pin technology allows the best in class electrical and mechanical performance. Higher parallelism for greater throughput. Individually replaceable cartridge design allows minimal downtime. Optimized design of Fan out PCB to insure best signal integrity.
The Volta Series Probe Head addresses a need for reduced test time set-up and increased throughput in high reliability testing of Wafer Level Packages (WLP), Wafer Level Chip Scale Packages (WLCSP) and Known Good Die (KGD) at 180 µm pitch and higher.
Smiths Interconnect offers high value Thermal Management Lid capabilities including air-chilled or liquid cooled technology, capable of dissipating up to 650 Watts. Our solutions are developed to be compatible with existing test hardware footprints for simple integration, reducing test set-up time and overall cost.