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The Volta Series Probe Head addresses a need for reduced test time set-up and increased throughput in high reliability testing of Wafer Level Packages (WLP), Wafer Level Chip Scale Packages (WLCSP) and Known Good Die (KGD) at 180 µm pitch and higher.
Customized test sockets for any IC packages. Suitable for lab, Engineering, SLT & ATE test application. Wide selection of Smiths Interconnects spring pins with low and stable contact resistance. World class design, Lab and manufacturing facility to ensure consistence product performance with highest customer satisfaction. Highly competitive price and global support.
The LightVISION® 10G VM Series is a range of affordable, reliable, high-performance embedded optical transceivers with bandwidth up to 120 Gbps. These are well suited for high-bandwidth commercial aerospace systems with the added benefit of reducing aircraft wiring and system weight and bringing fault, EMI/EMC and lightning tolerance.