Diamond is the best thermal conductor on earth. Combined with a low dielectric constant, it is an excellent RF dielectric material for high-frequency applications in which thermal performance is equally critical. By applying cutting-edge thin film process and extensive millimeter wave design experience, Smiths Interconnect has created a high-performance line of resistive components. The resulting products, our Diamond RF Resistives® resistors, terminations, and attenuators, are significantly reduced in size and unparalleled in average and peak power handling.
In-house capabilities encompass design, development, manufacturing and testing. Providing operational excellence tailored to volume manufacturing requirements, global sourcing, world class engineering talent and rapid prototyping.
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Smiths Interconnect offers a wide array of products to support signal distribution applications up to 20 GHz. The HybriX® 3 dB Hybrid Couplers are made for applications which require high isolation and low insertion loss. They are surface mountable and packaged in tape and reels. HybriX® Hybrid Couplers have a small footprint, low profile, and are RoHS compliant.
We are the world leader in fixed attenuators from DC through Q band. Fixed attenuators are available in 0.1 to 400 W versions, covering DC to 50 GHz applications and offered in 0 to 30dB values. Our attenuators are available in several package styles.
Low and high power RF resistors and terminations including surface mount chips, tab & cover chips, flange mounted and rod types. These resistors are available with Alumina, ALN, BeO and CVD substrate materials. The new CTX Series of high frequency wire bondable chip terminations and new CTX SMT Series of high frequency surface mount chip terminations are optimized to combine high frequency and power in a small package.
Smiths Interconnect’s Surface Mount Chip Resistors and Terminations offer increased power handling over conventional solutions. CXH series products feature Smiths Interconnect’s patented outrigger resistor technology (US 8, 994, 490) to offer substantially improved power handling over conventional resistors without compromising broadband performance.
The CEX series platform is an easy to implement surface mount solution for gain (or attenuation) variation over frequency. Various configuration options including frequency band, slope direction and slope magnitude are available to support various application demands.
Thermopad® products are a totally passive, easy to implement solution for gain compensation designed specifically for demanding high reliability applications.
Our attenuators are available in a low power chip package as well as a 0.250 sq high power BeO package. The input power ratings range from 0.1 to 120 watts. The attenuation values range from 0 dB to 20 dB with 30 dB available on some devices. The terminals of our chip attenuators are made with thick film material. Smith Interconnect is the world leader in fixed attenuators from DC through Q band.
The highest power to size ratio resistive products utilizing CVD Diamond, the best thermal conductor available. Diamond by EMC Technology brand, is the best thermal conductor on earth.
We offer a line of fixed attenuators in a high-reliability S-level common platform for space, military, and aerospace designs. The standard parts eliminate the need for costly and time-consuming drawings and specifications meeting the specification and testing requirements of MIL-PRF-55342.
SpaceNXT™ HC Series offers a selection of high reliability temperature variable attenuators for next generation commercial space applications.
Smiths Interconnect is a leading provider of technically differentiated electronic components, subsystems, microwave and radio frequency products that connect, protect and control critical applications in the commercial aviation, defense, space, medical, rail, semiconductor test, wireless telecommunications, and industrial markets.