Features & Benefits Industry-proven design, In-house tooling, molding and machining with 100% automated assembly. Extensive catalog of components, configurable options H-Pin offers unmatched DC performance Feature Options Auto IC loading / un-loading compatible High temperature materials for above 200 °C applications Drop-in replacement for legacy products
Series InfoRE 5 mm to 9 mm package size range for QFN, LGA, and BGA R 10 mm to 14 mm package size range for QFN and LGA 10 mm to 13 mm package size range for BGA Drop in replacement for legacy designs RL 16 mm to 19 mm package size range for QFN, LGA, and BGA
H Pin TechnologyEach socket uses the H-Pin contact technology providing wide RF performance capabilities and exceptional DC characteristics. The Q-Series socket checks all the boxes: high frequency, high current, high temperature, low inductance, and low loss. These features contribute to lower the cost of tests.