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Volta Series Probe Heads

Probe Head for WLCSP Test

The Volta Series Probe Head addresses a need for reduced test time set-up and increased throughput in high reliability testing of Wafer Level Packages (WLP), Wafer Level Chip Scale Packages (WLCSP) and Known Good Die (KGD) at 200 µm pitch and higher.

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Applications

Semiconductor

  • Wafer Level Test: Bluetooth
  • Wafer Level Test: Wi-Fi
  • Wafer Level Test: Power Management
Semiconductor Overview

Features & Benefits

The unique precision afforded by Smiths Interconnect's floating spring probe designs allows for seamless deployment in testing Wafer Level Chip Scale Packages. We work closely with our customers to develop contactors which are used as probe heads in place of cantilever and traditional vertical probe card technologies. Smiths Interconnect has created thousands of probe heads for every type of device and prober. In that process, we have created a WLCSP-optimized family of spring contact probes, the Volta Series.

  • Reliable RF signal integrity
  • Excellent compliance and contact force
  • Easy maintenance

Application Success: Increasing Digital Reliability

As computers, mobiles and smart devices become more advanced, so must the integrated chips that support them. Smiths Interconnect’s new Volta semiconductor test solutions, are leading the way. These solutions are used for testing the integrated chip packages behind everything from Bluetooth and power management to digital displays. Volta significantly outperforms the competition in both durability and performance.

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