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  • Raising the Bar of Burn-In Testing Sockets
    01 May

    Raising the Bar of Burn-In Testing Sockets

    • May 01, 2023

    Burn-in testing is widely used as an aid in producing failure-free electronic components. When scientifically planned and conducted, burn-in-testing sockets offer one of the most effective methods of reliability screening at the component level. Testing during production plays a vital role in ensuring reliability and repeatability. Semiconductor manufacturing plants perform tests at each stage of production to eliminate defective parts as early as possible while precisely controlling each process parameter of the chip.

  • Challenges Semiconductor Package Size and Pitch Face in Shrinking Consumer Electronics
    13 Mar

    BGA Sockets To Solve All Your Electronics Testing Needs

    • March 13, 2023

    Plastronics, a Smiths Interconnect technology brand, is a global provider of innovation for semiconductor reliability testing, meeting the industry’s burn-in socket needs for more than 40 years. It all started when our company invented the first open-top, application-specific socket for production burn-in of LCC packages. This innovation helped semiconductor manufacturers significantly increase their throughput and decrease costs.

  • Challenges Semiconductor Package Size and Pitch Face in Shrinking Consumer Electronics
    14 Feb

    Challenges Semiconductor Package Size and Pitch Face in Shrinking Consumer Electronics

    • February 14, 2023

    Tiny computers, smartphones, and small electronic devices that industry leaders and other companies have popularized are forcing the hand of semiconductor package designers to shrink the package to fit within these little hand-held gadgets. The demand for technology applications, such as smart homes, smart manufacturing, smart medical care, and automotive electronics, continues to increase. At the same time, the requirements of continuous miniaturization and functional diversification of electronic product demands also increase.