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Challenges Semiconductor Package Size and Pitch Face in Shrinking Consumer Electronics

BGA Sockets To Solve All Your Electronics Testing Needs

Plastronics, a Smiths Interconnect technology brand, is a global provider of innovation for semiconductor reliability testing, meeting the industry’s burn-in socket needs for more than 40 years. It all started when our company invented the first open-top, application-specific socket for production burn-in of LCC packages. This innovation helped semiconductor manufacturers significantly increase their throughput and decrease costs.