Micro Series Spring Probes
The Micro Probe Series ranges in pitch from 0.20" (0.51 mm) to 0.030" (0.76 mm) and are typically between 0.50" to 1.00" in length. Smiths Interconnect offers a wide range of Spring Contact Probes to meet your testing needs and has been recognized as a world leading provider for over 40 years.
| Probe | Probe OAL |
Max Travel |
Mating Receptacle |
|---|---|---|---|
| Quad-00 Series |
0.740 (18.80) |
0.100 (2.54) |
Quad-00 Series |
| Quad-0 Series |
0.900 (22.86) |
0.100 (2.54) |
Quad-0 Series |
Standard Spring Probes 0.039" Centers. Standard probe series for 0.039" (1.00 mm) pitch includes multiple length, travel, ICT, lead free and rotator options.
Standard probe series for 0.050" (1.27 mm) pitch includes multiple length, travel, ICT, lead free and rotator options.
The request for increased functionality in the smallest possible footprint has led to a reduction of the pitch of integrated circuits below 500 μm. At the same time, increased performances in SoCs affect pin-to-pin noise or what is commonly called crosstalk during testing.
There's no escaping the expectations to create more compact electronic components with higher functionality. Designing shrinking electronics is a challenge for all electronics manufacturers. Whatever industry you're in and no matter if you’re creating consumer, business, or military-grade electronics, there is a demand for building smaller, smarter, and sturdier electronics.
Creating more compact electronic components with higher functionality is a challenge for all electronics manufacturers. Whatever industry you're in, creating consumer, business, or military-grade electronics, the challenge presents itself, and the stakes are high. As electronics are expected to continue shrinking while increasing capabilities, blind mating connectors are required to meet those same size and functionality requirements.
As mobile phone electronics continue to shrink, WLCSP has become the de-facto packaging solution for IC’s going into today’s flagship handsets. Manufacturers need solutions to rapidly debug their new silicon, and quickly ramp it to HVM while achieving aggressive DPPB quality levels.
