- Use of standard VME bus architecture cages for high speed fibre channel connection.
- Bandwidth: Up to 3 Gigahertz
- P1 and P3 Mounting dimensions
- Board to board high speed data transfer
- Matched Impedance Differential Pair Twinax & Quadrax
- Data sampling rates exceeding 2 Gbits/second
- 21 position true differential pair blind mate contacts
- 150 and 100 Ohm matched impedance
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Rugged D-Sub with Twinax/Quadrax contacts
Split pair quadrax is the next generation contact that provides robust high-speed performance compatible with existing qualified rugged D-Sub connectors.
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Fibre Channel D-Sub
Utilizing a multi-finger ground spring fixed around the shell to provide a multi-point contact engagement that affords superior EMI shielding.
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Micro Quadrax/Twinax
Feature matched impedance miniaturized connectors that provide the user with controlled impedance and tightly spaced PCB footprint spacing.
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Accelerating Device Bring-Up and Production Ramp for WLCSP 5G Mobile IC’s
As mobile phone electronics continue to shrink, WLCSP has become the de-facto packaging solution for IC’s going into today’s flagship handsets. Manufacturers need solutions to rapidly debug their new silicon, and quickly ramp it to HVM while achieving aggressive DPPB quality levels.
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Kelvin Probes Provide First-Class Performance for High-volume Final Test of Standard Array and Wafer-level Devices
The unique beveled tip provides reliable, stable contact resistance for applications where chip test is critical, such as IoT, Mobile, Internet, and Automotive.
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Volta Product Pushes Testing Technology Boundaries
A High Performance, Cost-effective Alternative in Wafer Level Chip Scale Package Testing
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Next Generation DaVinci 56 Test Socket
Coaxial Test Solution for IC Testing to 67 GHz / 56 Gbps