Skip to content

Signal Distribution

Smiths Interconnect offers a wide array of products to support signal distribution applications up to 50 GHz. They are surface mountable for ease of installation, have a small footprint, and are RoHS compliant.

Features & Benefits

  • Wilkinson and Resistive Power Dividers with 2-, 3- and 4-way power splits and operating frequency up to 50 GHz
  • Crossovers which bridge an RF signal over a DC line or two RF signals replacing the use of multilayer RF board or RF coaxial jumpers
  • Power Samplers which provide a simple yet reliable way to implement signal or power tap-off
  • All HybriX® products provide high performance in compact footprint. The surface-mountable signal distribution products are constructed with advanced alumina and aluminum nitride materials.
  • Power dividers available for though 6G bands
  • Surface mountable
  • High power handling
  • Low insertion loss
  • RoHS compliant
  • Tape & Reel packaging
  • Power Division up to 12 Ways

Related News

  • Image of TSX Series

    Making Sense of High-Reliability Radio Frequency (RF ) Components

    HR TSX Series represents a significant leap forward in the realm of high-frequency surface mount chip attenuators. Its combination of small form factor, robust construction, and versatile performance make it an attractive choice for space and defense applications.

  • Image of HBB Power Connectors

    New high-power connectors for demanding defense applications

    The new HBB connector takes the 500 amp version of a single-pole and replaces the internals to have five poles, each with size eight contacts and two interlocked pins. This means that in a very tight space, the customer can run five power lines which increases the connectors’ flexibility and offers the ability to run redundant lines as required.

  • Image of New  Wideband Surface Mount Fixed Attenuators

    New Wideband Surface Mount Fixed Attenuators

    Utilizing more than 40 years of experience in refining attenuation solutions for the defence, the TT9 offers a power handling capability of 500 mW while maintaining excellent impedance matching in an SMT package.