Modular burn-in socket with clamshell-style lid. Range of package accommodations, from 0.5 mm body size up to 12 mm and optimal socket density per burn-in board.

Performance burn-in socket, with a clamshell-style lid that can be equipped with a heater and thermal sensor.

The modular lid construction can handle up to 1 kW of power and is optimized with thermal simulation to ensure out-of-the-box performance whether liquid or air cooled. 

Serving package sizes 20.0mm X 20.0mm (max) and pitch from 0.40mm – 0.65mm.

High-performance burn-in socket, with dual latch clamshell lid to provide co-planar pressure on the DUT when the lid is actuated.

This socket also uses the H-Pin contact technology providing wide RF performance capabilities and exceptional DC characteristics. The K-Series socket checks all the boxes: high frequency, high current, high temperature, low inductance, and Low loss.

The small outline footprint provides design flexibility and allows for high socket density on the burn-in board.

Available for mid to large package sizes with a fully molded socket body and lid designed to meet the rigors of a wide variety of accelerated life testing applications.

These sockets offer a modular design in a small outline with very low inductance. Open Top QFN socket allows for more convenient package loading and unloading in most of the same lead count options as the lidded version.

Open-top reliability socket used for accelerated life testing. With versions of the compression mount open-top design available as a drop-in replacement for other legacy products on the market.