Skip to content

QN-Series

Accelerated life testing solution

Smiths Interconnect has taken a leadership role in designing and developing socket solutions for the newest QFN packages such as MLF, BCC, and LPCC. These sockets offer a modular design in a small outline with very low inductance. The new Open Top QFN socket allows for more convenient package loading and unloading in most of the same lead count options as the lidded version.

Download Brochure

Features & Benefits

  • Available in 0.40 mm, 0.50 mm, 0.65 mm,  0.80 mm, and 1.00 mm pitches
  • Custom pitches down to 0.30 mm
  • Lidded and Open Top Sockets for ≤10 mm packages
  • Lidded Sockets for 10 mm to 16 mm packages
  • Center ground pin standard for all sockets
  • Optional copper heat slug available for high wattage devices
  • Sockets for over 80 different JEDEC standard footprints

Related News

  • Image of Custom Connectors VS Catalog Connectors: Benefit Breakdown and Challenges

    Custom Connectors VS Catalog Connectors: Benefit Breakdown and Challenges

    There's no escaping the expectations to create more compact electronic components with higher functionality. Designing shrinking electronics is a challenge for all electronics manufacturers. Whatever industry you're in and no matter if you’re creating consumer, business, or military-grade electronics, there is a demand for building smaller, smarter, and sturdier electronics.

  • Widget Image ALT

    New Volta 180 supports Wafer Level Packages and Known Good Dies test businesses

    The new Volta 180 Series is an advanced WLCSP test solution that expands Volta product line to include the compact 180um pitch, allowing for a higher number of chips to be tested on each wafer. It allows for a fast and reliable testing of wafers to ensure that they meet specifications and perform as they should, which translates into higher quality end products.

  • Image of Rethinking Blind Mate Connectors to Increase Reliability in Miniaturized Electronics Assembly

    Rethinking Blind Mate Connectors to Increase Reliability in Miniaturized Electronics Assembly

    Creating more compact electronic components with higher functionality is a challenge for all electronics manufacturers. Whatever industry you're in, creating consumer, business, or military-grade electronics, the challenge presents itself, and the stakes are high. As electronics are expected to continue shrinking while increasing capabilities, blind mating connectors are required to meet those same size and functionality requirements.