Skip to content
Login Register

Signal Distribution

Smiths Interconnect offers a wide array of products to support signal distribution applications up to 50 GHz. They are surface mountable for ease of installation, have a small footprint, and are RoHS compliant.

Features & Benefits

  • Wilkinson and Resistive Power Dividers with 2-, 3- and 4-way power splits and operating frequency up to 50 GHz
  • Crossovers which bridge an RF signal over a DC line or two RF signals replacing the use of multilayer RF board or RF coaxial jumpers
  • Power Samplers which provide a simple yet reliable way to implement signal or power tap-off
  • All HybriX® products provide high performance in compact footprint. The surface-mountable signal distribution products are constructed with advanced alumina and aluminum nitride materials.
  • Power dividers available for though 6G bands
  • Surface mountable
  • High power handling
  • Low insertion loss
  • RoHS compliant
  • Tape & Reel packaging
  • Power Division up to 12 Ways

Documents & Literature

Related News

  • Image of Reflex Photonics

    Smiths Interconnect acquires Reflex Photonics

    Reflex complements Smiths Interconnect’s product offering with the addition of a core fibre optic capability that will help address the needs arising from high speed data transmission in market segments requiring high reliability.

  • Widget Image ALT

    Distribution agreement with Heilind Electronics

    The agreement with Heilind Inc. completes the business relationship already existing with Heilind in Europe and Asia, making the company a global partner for the distribution of Smiths Interconnect’s products.

  • Image of LightConex

    New blind mate active optical interconnect product line compatible with VITA and SOSA standards.

    Expanding on the successful LightCONEX style A compatible with VITA 66.4 aperture, Reflex Photonics is launching its style B and style C, both compatible with VITA 67.3 type C, D and E standard apertures. These VITA 67.3 apertures can be populated with modules that are either single active, dual active/passive, or a combination of optical and RF coaxial connectors. This flexibility will be particularly attractive to integrators that need to combine multiple I/O interfaces while keeping size, weight, and power (SWaP) at the minimum.