Skip to content
Login Register

ESJ Series H-Pin Socket

ESJ Series socket is a high-performance burn-in socket, with dual latch clamshell lid to provide co-planar pressure on the DUT when the lid is actuated. The patented H-Pin contact technology in the ESJ Series socket provides versatility and the ability to use the same socket for multiple application needs and test functions.

Download Brochure

Features & Benefits

  • Configurable design, in-house tooling, molding and machining provide short lead times.
  • Extensive catalog of components, drive reduction in cost of test.
  • Modular lid design allows for easy configuration of different end-use requirements.
  • Exceptional electrical performance provides wide RF bandwidth.

Feature Options

  • Spring loaded plunger
  • Heat sink
  • HAST venting features
  • Integrated thermal control with heater and sensor
  • Reverse seating plane
  • Max component clearance under the DUT
  • High temperature materials for above 200 °C application

Documents & Literature

Related Products

  • Image of H-Pin®

    H-Pin®

    A stamped spring probe with the mechanical, electrical, and thermal performance of a spring probe, and the ease of use and high volume manufacturability of a stamped contact.

Related News

  • Image of Challenges Semiconductor Package Size and Pitch Face in Shrinking Consumer Electronics

    Challenges Semiconductor Package Size and Pitch Face in Shrinking Consumer Electronics

    Tiny computers, smartphones, and small electronic devices that industry leaders and other companies have popularized are forcing the hand of semiconductor package designers to shrink the package to fit within these little hand-held gadgets. The demand for technology applications, such as smart homes, smart manufacturing, smart medical care, and automotive electronics, continues to increase. At the same time, the requirements of continuous miniaturization and functional diversification of electronic product demands also increase.

  • Image of Raising the Bar of Burn-In Testing Sockets

    Raising the Bar of Burn-In Testing Sockets

    Burn-in testing is widely used as an aid in producing failure-free electronic components. When scientifically planned and conducted, burn-in-testing sockets offer one of the most effective methods of reliability screening at the component level. Testing during production plays a vital role in ensuring reliability and repeatability. Semiconductor manufacturing plants perform tests at each stage of production to eliminate defective parts as early as possible while precisely controlling each process parameter of the chip.