Integrated test solutions for 5G, data centers, and high-speed test applications The rapid expansion of connected devices and data-intensive applications is driving the growing demand for highly efficient and adaptive high-performance computing solutions. Mobile devices such as cell phones, tablets and car infotainment systems have the most sophisticated System-on-Chip (SoCs) ever produced. Details
Custom Grid Array: high-density, robust and cost-effective RF performance for medical devices In this webinar we will discuss the current and emerging trends of miniaturization and more cost effective solutions, and how this can be addressed using alternatives to traditional coax solutions. Details
Addressing Changing Standards to Meet Cable Assembly Requirements in New Space Applications The shift in market trends from GEO to LEO and large satellites to constellation systems have introduced several changes to environmental and reliability requirements. This webinar will address the way these changes affect qualifications, lot acceptance tests, and reliability standards related to cable assemblies designed for new space applications. Details
Optimize HVAC system design with right choice of connector HAVC system brings together a number of different industrial equipment in a very tightly packed space, all of which are expected to work in harmony. The choice of connector and cable at the early design stage, can help many HVAC system optimize its layout and operate efficiently. Smiths Interconnect would present a choice of connectors used by many HVAC system designers over a decade. This webinar will bring together decades of experience in collaborating with HVAC system designers and how choice of connector played a crucial role. Details
Addressing Qualification Standards, Product Specifications and Environmental Factors for Passive RF Board Level Components in Space and Defense This webinar will address customer’s adaptation of the current industry qualifications standards, product specifications and environmental factors for proper design and development of RF board level devices and components for new space and defense applications. The focus will be MIL-PRF-55342 and other military standards for passive RF component reliability, reducing lead time and cost of ownership. Details
Advantages and Challenges of Planar Thin Film Bandpass Technology in RF Applications Applications in the X, Ku and Ka bands require smaller size and weight components while providing high electrical response performance. In this webinar, Smiths Interconnect experts will address the advantages and challenges of RF filters that have reduced size and weight but also provide minimal loss in the passband and maximum rejection in the stopbands. Details
The next generation of high-speed, cable-free PCB connector solutions for the railway and industrial markets Are you a Chinese-speaking professional? Free registration for the on demand webinar in Chinese about our latest interconnect solutions for today's advanced electronics systems in rail and industrial applications. 通用于铁路和工业市场的下一代高速无缆化PCB连接器解决方案 Details
High Power Interconnects How the Hyperboloid Technology can Provide Superior Performance in Defense and Aerospace Applications. Details
Hypergrip® Series: Choosing the Right Connectivity Solution for Your Medical Application HyperGrip® series is a patented and proven high reliability circular connector series specifically designed for the medical industry, thanks to its reliability, versatility, customer keying system and quick and accurate connections. This webinar will take you through the history of Smiths Interconnect medical connectivity with an overview of the Hypergrip® series and other valuable solutions for your healthcare systems. Details
Next Generation VPX Optical Backplanes This webinar will review the OpenVPX/VITA 66.5 standard specifying embedded, military sensing and computing systems based on a new type of active, optical backplane. This will bring significant improvements in lifecycle management, maintenance, and SWaP (size/weight/power) to ruggedized airborne, ground, and naval platforms. Details