Chinese‑language webinar with DigiTimes Asia on next‑gen AI chip testing. Learn 2026+ trends, practical solutions for BGA/LGA, and join live Q&A with Smiths Interconnect experts.
Join Smiths Interconnect & RFMW to learn RF filter selection: topology trade-offs, an auto-pick tool, and a proven path to rugged mil/aero/space builds.
Discover how our fully integrated fiber optic transceiver and VITA 87 connector solution enables high-speed, high-reliability data links for mission-critical defense and aerospace applications. This webinar shows how an end-to-end optical architecture improves performance, reduces SWaP, and simplifies integration into SOSA/VPX/CMOSS platforms.
High‑power battery systems in harsh, high‑demand environments call for interconnects that carry peak current safely and efficiently. This session outlines the single‑pole, high‑power connector approach—incl. Hypertac Green Connect™—with architecture choices, integration in heavy‑duty use cases, and practical selection criteria.
Temperature effects can wreak havoc on transmit/receive module (TRM) performance. This webinar will describe two mitigation approaches: active and passive. For the passive approach, selection criteria, integration suggestions, and performance expectations will be presented.
Attendees will gain practical insights into matching system requirements with appropriate filter types and technologies — discrete, cavity, ceramic, waveguide, and co-planar — across defense, space, and commercial applications.
This webinar will demonstrate a new product that can be used in place of solder SMPs for board to board applications. EZiCoax is a spring-loaded coax contact that can pass signals up to 40 GHz between two points. It uses an Interposer or frame for alignment and requires no tooling to implement.
This webinar explores the current requirements and future needs for successfully testing the reliability of next-generation AI Accelerator processor units.
Our expert will provide insights into the electrical and mechanical principles behind these sockets, explore test applications, and compare them to traditional probe sockets.
Global conflicts and geopolitical tensions are driving demand for additional and more advanced radar systems. Key attributes of these systems include being “Fast to the Field”, extended long-range capability, adaptability, reliability, and having a low lifecycle cost. Selecting the right components is critical for design and manufacturing success.
Limited and single-use connections for medical devices are a growing area of need. In recent times, there has been an increasing focus on developing connectors that are safe, reliable, and cost-effective for single use applications. This has been motivated by the need to reduce the risk of cross-contamination and improve hygiene in medical environments.
Smiths Interconnect is proudly introducing Hypertac Green Connect, an advanced design of the hyperboloid contact to solve the absolute fundamental problem of power loss to allow the battery use every kWh of energy efficiently. In this webinar we'll discuss about the current market situation and what our product would do to solve the issue.
Smiths Interconnect's NASA S-311-P-822 compliant high performance ruggedized cPCI connectors have a long legacy in space flight applications. Learn more about our customer's success stories within the Mars 2020 Perseverance Rover mission.
This webinar will address customer’s needs for RF board level devices and components requiring temperature compensation that increases product performance & adds reliability for their mission critical applications and programs.
This webinar will cover the current and emerging trends in the medical device industry overall, with a special focus on imaging and interventional, including electrophysiology. Our experts will particularly focus on applications where demand for smaller, lighter, and more flexible connectors is increasing for next generation devices in the areas of tissue ablation, cardiac mapping, and imaging.
In this webinar we will discuss the challenges in designing and manufacturing an electro-mechanical interface for testing a Integrated Circuit running at 224 Gbps data rates. We will discuss the roadblocks in working in a fully simulated environment and our products that are capable of meeting next generation Integrated Circuit requirements.
The objective of this webinar is to share the concept of RF filter-based passive multi-function assemblies (MFA). Examples are provided that incorporate such functions as transitions, RF filters, ferrite isolators, non-directional couplers and high-power terminations that illustrate the advantages and the pitfalls that can readily be avoided.
In this webinar we will talk about Smiths interconnect's versatile connectivity solutions equipped with the Hyperboloid contact technology which provides the lowest contact resistance, high mating cycles and smallest dimensions in the market.
This webinar will focus on Smiths Interconnects' newly space qualified KVPX Backplane Connector. KVPX connectors are qualified to EEE-INST-002 Level 1 and are equipped with Hypertac® space-qualified 0.4 mm hyperboloid sockets and provide immunity to shock and vibration fretting, numerous linear paths of contact, low-forces, high mating cycles, and a self-wiping cleaning action that results in consistently better integrity in extreme environments.
This webinar will focus on common contact technologies used in the connector industry and how to avoid fretting corrosion by implementing Hypertac® hyperboloid contact technology in your connector designs. This contact technology offers proven benefits and our engineering teams over the years continue to creatively adapt the concept to meet the needs of so many diverse applications.
Hypertac contact technology offers proven benefits and our engineering teams over the years continue to creatively adapt the concept to meet the needs of so many diverse applications.
During this webinar our experts will discuss the key advantages of the technology and how it can aid the process of electrification in applications requiring power charging.
The objective of this webinar is to share the concept of passive multi-function assemblies (MFAs), with examples provided that incorporate such functions as transitions, RF filters, ferrite isolators, non-directional couplers and high-power terminations. It will illustrate the advantages and the pitfalls that can readily be avoided and will offer an understanding of the trade-offs and benefits of MFAs in the defense and space industries.
The rapid expansion of connected devices and data-intensive applications is driving the growing demand for highly efficient and adaptive high-performance computing solutions. Mobile devices such as cell phones, tablets and car infotainment systems have the most sophisticated System-on-Chip (SoCs) ever produced.
In this webinar we will discuss the current and emerging trends of miniaturization and more cost effective solutions, and how this can be addressed using alternatives to traditional coax solutions.
The shift in market trends from GEO to LEO and large satellites to constellation systems have introduced several changes to environmental and reliability requirements. This webinar will address the way these changes affect qualifications, lot acceptance tests, and reliability standards related to cable assemblies designed for new space applications.
HAVC system brings together a number of different industrial equipment in a very tightly packed space, all of which are expected to work in harmony. The choice of connector and cable at the early design stage, can help many HVAC system optimize its layout and operate efficiently. Smiths Interconnect would present a choice of connectors used by many HVAC system designers over a decade. This webinar will bring together decades of experience in collaborating with HVAC system designers and how choice of connector played a crucial role.
This webinar will address customer’s adaptation of the current industry qualifications standards, product specifications and environmental factors for proper design and development of RF board level devices and components for new space and defense applications. The focus will be MIL-PRF-55342 and other military standards for passive RF component reliability, reducing lead time and cost of ownership.
Applications in the X, Ku and Ka bands require smaller size and weight components while providing high electrical response performance. In this webinar, Smiths Interconnect experts will address the advantages and challenges of RF filters that have reduced size and weight but also provide minimal loss in the passband and maximum rejection in the stopbands.
Are you a Chinese-speaking professional? Free registration for the on demand webinar in Chinese about our latest interconnect solutions for today's advanced electronics systems in rail and industrial applications.
通用于铁路和工业市场的下一代高速无缆化PCB连接器解决方案
HyperGrip® series is a patented and proven high reliability circular connector series specifically designed for the medical industry, thanks to its reliability, versatility, customer keying system and quick and accurate connections. This webinar will take you through the history of Smiths Interconnect medical connectivity with an overview of the Hypergrip® series and other valuable solutions for your healthcare systems.
Safety critical applications with high vibration and extreme temperature need specially designed, robust and reliable connector systems. Systems must work under extreme temperature, mechanical shock and vibration, difficult access, water or dirt and dust ingress, and fretting corrosion. Smiths Interconnect has designed specialized connectors that withstand all these different challenges.
Solid state power amplifiers (SSPA) have been with us for decades. With each new generation of transistors and FETs SSPAs have extended their effective operating frequency and bandwidth, RF power and efficiency. As the years and technology have progressed, ferrite isolators, and in some cases circulators, have continued to provide a cost-effective solution to buffer the gain stages and protect the SSPA from reflected power.
The next generation of Smiths Interconnect floating mount, PCB signal and Ethernet connectors for complex electronics system are the ideal solution to the market increasing needs for small size, high-speed, and reliability in a unique product.
This webinar will describe why optic communications in space are a key element of the success of new global connectivity networks. From intra-satellite to inter-satellite high speed links, optical communication over fiber optics or over optical wireless terminals can help by extracting the most from the communication architectures while offering low SWaP.
The train of the future will have higher needs in terms of bandwidth, functionalities and service quality: digitalisation, CO2 footprint, smart power distribution, operational standardization and regulations compliance are key areas of opportunities for the railway post-pandemic sector to improve their competitiveness.
Smiths Interconnect experts describe state-of-the art of Thermal Management Solutions applied to advanced digital processor IC devices. Special attention will be given to the emerging SiP and large BGA package challenges facing the industry.
Learn from our industry experts as they share RF cable assembly challenges focused on radiation harden materials, cable routing, cable modularity, shielding effectiveness and lowering cost of ownership.
April 29, 2026
May 22, 2024
-2?ext=.jpg&width=480&resizemode=force)
?ext=.jpg&width=480&resizemode=force)
