In this webinar we will discuss the challenges in designing and manufacturing an electro-mechanical interface for testing a Integrated Circuit running at 224 Gbps data rates. We will discuss the roadblocks in working in a fully simulated environment and our products that are capable of meeting next generation Integrated Circuit requirements.
The objective of this webinar is to share the concept of RF filter-based passive multi-function assemblies (MFA). Examples are provided that incorporate such functions as transitions, RF filters, ferrite isolators, non-directional couplers and high-power terminations that illustrate the advantages and the pitfalls that can readily be avoided.
In this webinar we will talk about Smiths interconnect's versatile connectivity solutions equipped with the Hyperboloid contact technology which provides the lowest contact resistance, high mating cycles and smallest dimensions in the market.
This webinar will focus on Smiths Interconnects' newly space qualified KVPX Backplane Connector. KVPX connectors are qualified to EEE-INST-002 Level 1 and are equipped with Hypertac® space-qualified 0.4 mm hyperboloid sockets and provide immunity to shock and vibration fretting, numerous linear paths of contact, low-forces, high mating cycles, and a self-wiping cleaning action that results in consistently better integrity in extreme environments.
This webinar will focus on common contact technologies used in the connector industry and how to avoid fretting corrosion by implementing Hypertac® hyperboloid contact technology in your connector designs. This contact technology offers proven benefits and our engineering teams over the years continue to creatively adapt the concept to meet the needs of so many diverse applications.
Hypertac contact technology offers proven benefits and our engineering teams over the years continue to creatively adapt the concept to meet the needs of so many diverse applications.
During this webinar our experts will discuss the key advantages of the technology and how it can aid the process of electrification in applications requiring power charging.
The objective of this webinar is to share the concept of passive multi-function assemblies (MFAs), with examples provided that incorporate such functions as transitions, RF filters, ferrite isolators, non-directional couplers and high-power terminations. It will illustrate the advantages and the pitfalls that can readily be avoided and will offer an understanding of the trade-offs and benefits of MFAs in the defense and space industries.
The rapid expansion of connected devices and data-intensive applications is driving the growing demand for highly efficient and adaptive high-performance computing solutions. Mobile devices such as cell phones, tablets and car infotainment systems have the most sophisticated System-on-Chip (SoCs) ever produced.
In this webinar we will discuss the current and emerging trends of miniaturization and more cost effective solutions, and how this can be addressed using alternatives to traditional coax solutions.
The shift in market trends from GEO to LEO and large satellites to constellation systems have introduced several changes to environmental and reliability requirements. This webinar will address the way these changes affect qualifications, lot acceptance tests, and reliability standards related to cable assemblies designed for new space applications.
HAVC system brings together a number of different industrial equipment in a very tightly packed space, all of which are expected to work in harmony. The choice of connector and cable at the early design stage, can help many HVAC system optimize its layout and operate efficiently. Smiths Interconnect would present a choice of connectors used by many HVAC system designers over a decade. This webinar will bring together decades of experience in collaborating with HVAC system designers and how choice of connector played a crucial role.
This webinar will address customer’s adaptation of the current industry qualifications standards, product specifications and environmental factors for proper design and development of RF board level devices and components for new space and defense applications. The focus will be MIL-PRF-55342 and other military standards for passive RF component reliability, reducing lead time and cost of ownership.
Applications in the X, Ku and Ka bands require smaller size and weight components while providing high electrical response performance. In this webinar, Smiths Interconnect experts will address the advantages and challenges of RF filters that have reduced size and weight but also provide minimal loss in the passband and maximum rejection in the stopbands.
Are you a Chinese-speaking professional? Free registration for the on demand webinar in Chinese about our latest interconnect solutions for today's advanced electronics systems in rail and industrial applications.
通用于铁路和工业市场的下一代高速无缆化PCB连接器解决方案
HyperGrip® series is a patented and proven high reliability circular connector series specifically designed for the medical industry, thanks to its reliability, versatility, customer keying system and quick and accurate connections. This webinar will take you through the history of Smiths Interconnect medical connectivity with an overview of the Hypergrip® series and other valuable solutions for your healthcare systems.
Safety critical applications with high vibration and extreme temperature need specially designed, robust and reliable connector systems. Systems must work under extreme temperature, mechanical shock and vibration, difficult access, water or dirt and dust ingress, and fretting corrosion. Smiths Interconnect has designed specialized connectors that withstand all these different challenges.
Solid state power amplifiers (SSPA) have been with us for decades. With each new generation of transistors and FETs SSPAs have extended their effective operating frequency and bandwidth, RF power and efficiency. As the years and technology have progressed, ferrite isolators, and in some cases circulators, have continued to provide a cost-effective solution to buffer the gain stages and protect the SSPA from reflected power.
The next generation of Smiths Interconnect floating mount, PCB signal and Ethernet connectors for complex electronics system are the ideal solution to the market increasing needs for small size, high-speed, and reliability in a unique product.
Join our webinar on Monday October 20th 11am PDT to learn from our industry experts Engineering Director, Doug LaFreniere and Product Director, David Popelka as they share Antenna challenges focused on operational requirements, enabling technologies and product solutions.
During the webinar, Smiths Interconnect experts will demonstrate key advantages of the technology supported by examples, applications and success stories. Among these we will discuss the proper mating, low cost of ownership, high reliability, contact design, operating environment.
This webinar will describe why optic communications in space are a key element of the success of new global connectivity networks. From intra-satellite to inter-satellite high speed links, optical communication over fiber optics or over optical wireless terminals can help by extracting the most from the communication architectures while offering low SWaP.
In this webinar, Smiths Interconnect experts will examine the different RF filter technologies, evaluate key parameters when choosing an RF filter, and discuss current and future RF filter trends. Special attention will be given to the emerging planar chip filter and thick, and thin film processing technology.
The train of the future will have higher needs in terms of bandwidth, functionalities and service quality: digitalisation, CO2 footprint, smart power distribution, operational standardization and regulations compliance are key areas of opportunities for the railway post-pandemic sector to improve their competitiveness.
Smiths Interconnect experts describe state-of-the art of Thermal Management Solutions applied to advanced digital processor IC devices. Special attention will be given to the emerging SiP and large BGA package challenges facing the industry.
Learn from our industry experts as they share RF cable assembly challenges focused on radiation harden materials, cable routing, cable modularity, shielding effectiveness and lowering cost of ownership.
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