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On Demand Webinars

What are 5 Challenges RF Cable Assembly Face in the Space Industry?

Learn from our industry experts as they share RF cable assembly challenges focused on radiation harden materials, cable routing, cable modularity, shielding effectiveness and lowering cost of ownership.

Advanced Thermal Management for High-Power IC Test

Smiths Interconnect experts describe state-of-the art of Thermal Management Solutions applied to advanced digital processor IC devices. Special attention will be given to the emerging SiP and large BGA package challenges facing the industry.