Introducing the Joule 20 Test Socket Solution for QFN Package Testing We will outline how Joule-20 can provide a drop-in replacement that can be used with existing PCB footprints, brining you increased ROI in both Engineering / Characterization applications as well as High Volume Manufacturing. Details
How Hypertac® hyperboloid contact technology ensures higher performance to your applications During the webinar, Smiths Interconnect experts will demonstrate key advantages of the technology supported by examples, applications and success stories. Among these we will discuss the proper mating, low cost of ownership, high reliability, contact design, operating environment. Details
Optical interconnects: addressing the unique challenges in space applications This webinar will describe why optic communications in space are a key element of the success of new global connectivity networks. From intra-satellite to inter-satellite high speed links, optical communication over fiber optics or over optical wireless terminals can help by extracting the most from the communication architectures while offering low SWaP. Details
Understanding which RF Filter Technology works best for your next module design In this webinar, Smiths Interconnect experts will examine the different RF filter technologies, evaluate key parameters when choosing an RF filter, and discuss current and future RF filter trends. Special attention will be given to the emerging planar chip filter and thick, and thin film processing technology. Details
Today's challenges and opportunities for a sustainable railway transport connectivity The train of the future will have higher needs in terms of bandwidth, functionalities and service quality: digitalisation, CO2 footprint, smart power distribution, operational standardization and regulations compliance are key areas of opportunities for the railway post-pandemic sector to improve their competitiveness. Details
Advanced Thermal Management for High-Power IC Test Smiths Interconnect experts describe state-of-the art of Thermal Management Solutions applied to advanced digital processor IC devices. Special attention will be given to the emerging SiP and large BGA package challenges facing the industry. Details
What are 5 Challenges RF Cable Assembly Face in the Space Industry? Learn from our industry experts as they share RF cable assembly challenges focused on radiation harden materials, cable routing, cable modularity, shielding effectiveness and lowering cost of ownership. Details