Hypergrip® Series: Choosing the Right Connectivity Solution for Your Medical Application HyperGrip® series is a patented and proven high reliability circular connector series specifically designed for the medical industry, thanks to its reliability, versatility, customer keying system and quick and accurate connections. This webinar will take you through the history of Smiths Interconnect medical connectivity with an overview of the Hypergrip® series and other valuable solutions for your healthcare systems. Details
Next Generation VPX Optical Backplanes This webinar will review the OpenVPX/VITA 66.5 standard specifying embedded, military sensing and computing systems based on a new type of active, optical backplane. This will bring significant improvements in lifecycle management, maintenance, and SWaP (size/weight/power) to ruggedized airborne, ground, and naval platforms. Details
Space-saving and Cost-effective Chip Attenuators with Excellent Broadband Performance and High Power-to-size Ratio The acceleration of demand for communication and data transmission in the digital age is creating a huge market for broadband connectivity. Details
Rugged Circular Connectors for Sensors in Braking Systems and High Shock, Vibration Applications Safety critical applications with high vibration and extreme temperature need specially designed, robust and reliable connector systems. Systems must work under extreme temperature, mechanical shock and vibration, difficult access, water or dirt and dust ingress, and fretting corrosion. Smiths Interconnect has designed specialized connectors that withstand all these different challenges. Details
Ferrite Isolators and Circulators for SSPA Applications Solid state power amplifiers (SSPA) have been with us for decades. With each new generation of transistors and FETs SSPAs have extended their effective operating frequency and bandwidth, RF power and efficiency. As the years and technology have progressed, ferrite isolators, and in some cases circulators, have continued to provide a cost-effective solution to buffer the gain stages and protect the SSPA from reflected power. Details
Next-Generation Floating Mount and PCB Connectors for Complex Electronics The next generation of Smiths Interconnect floating mount, PCB signal and Ethernet connectors for complex electronics system are the ideal solution to the market increasing needs for small size, high-speed, and reliability in a unique product. Details
High Frequency Spring Loaded Interposers for Space and Defence How rugged, solderless Spring Probe Interposers solve the demanding board to board connectivity challenges Details
Antennas for Enabling UAV Line-of-Sight C2 and Data Join our webinar on Monday October 20th 11am PDT to learn from our industry experts Engineering Director, Doug LaFreniere and Product Director, David Popelka as they share Antenna challenges focused on operational requirements, enabling technologies and product solutions. Details
Introducing the Joule 20 Test Socket Solution for QFN Package Testing We will outline how Joule-20 can provide a drop-in replacement that can be used with existing PCB footprints, brining you increased ROI in both Engineering / Characterization applications as well as High Volume Manufacturing. Details
How Hypertac® hyperboloid contact technology ensures higher performance to your applications During the webinar, Smiths Interconnect experts will demonstrate key advantages of the technology supported by examples, applications and success stories. Among these we will discuss the proper mating, low cost of ownership, high reliability, contact design, operating environment. Details