High-Performance Compute, Artificial Intelligence, and Machine Learning are driving a new wave of demand for extremely large and complex chips. These giant chips – typically over 20B transistors per device – required enormous power draws, which in turn, generates heat. To address these challenges, sophisticated thermal system modelling must be applied, and custom solutions must be design around these models. For device manufacturers, it has become critical to properly manage IC thermal output during the critical device testing phases.
In this Webinar, Smiths Interconnect experts describe state-of-the art of Thermal Management Solutions applied to advanced digital processor IC devices. Special attention will be given to the emerging SiP and large BGA package challenges facing the industry.
Key Learning Objectives
- Advanced thermal management for high power ICs
- Cooling solutions for high performance ICs
- Basics of thermal management and cooling solutions
Audience
- Product Managers
- Product Line Managers
- Program Manager
- Engineer
- Design Engineer
- Engineering Technician
- Electrical Engineers
- Communications Technician
- VP of Engineering
- Head of Research and Development
- Purchasing Manager
- Commodity Manager
- Supply Chain Manager
- Logistics Manager
- Senior technical Expert
- Source Manager