Based on Reflex Photonics technology, these rugged embedded transceivers offer bandwidth up to 300 Gbps in a chip-sized component. Designed for harsh environments including space, military, aerospace, and industrial applications, the transceivers provide high I/O density with low SWaP. Versions are available for mounting mid-board, front-panel, or on a VPX backplane (aligned with the SOSA™ technical standard).
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The SpaceABLE® 28G SL Series radiation resistant transceivers are engineered to withstand radiation doses >100 krad (Si). The SpaceABLE 28G SL Series low profile screw-in module mounts to the board via an LGA connector (interposer). It is offered as a either a (4+4)-lane transceiver (100G full-duplex) or as separate 12-channel transmitter and 12-channel receiver modules (300G half-duplex, as a pair) that operate at up to 28 Gbps per channel over a recommended operating temperature range of –40 ºC to 85 ºC at ultra-low bit error rates of 10-9.
The SpaceABLE® 10G SM Series radiation resistant transceivers are engineered to withstand radiation doses >100 krad (Si). The low profile SpaceABLE 10G SL Series screw-in module mounts to the board via an LGA connector (interposer). It is offered as a (4+4)-lane transceiver, a 12-channel transmitter, or a 12-channel receiver. All modules operate at 10.3125 Gbps per channel over a recommended operating temperature range of –40 ºC to 85 ºC at ultra-low bit error rates of 10-12.
The LightABLE™ 28G LL Series low profile screw-in module mounts to the board via an LGA connector (interposer). It is offered as a either a (4+4)-lane transceiver (100G full-duplex) or as separate 12-channel transmitter and 12-channel receiver modules (300G half-duplex as a pair) that operate at up to 28 Gbps per channel from −40 °C to 85 °C at ultra-low bit error rates of 10-12.
The low profile LightABLE™ 10G LL Series screw-in module (4.5 mm) mounts to the board via a 1 mm LGA connector (interposer). It is offered as (12+12)-lane transceiver. These modules operate at 10.3125 Gbps per channel over a recommended operating temperature range of −40 °C to 85 °C at ultra-low bit error rates of 10-12.
The low profile LightABLE™ 10G LL Series screw-in module (4.5 mm) mounts to the board via a 1 mm LGA connector (interposer). It is offered as a (4+4)-lane transceiver, a 12-channel transmitter, and a 12-channel receiver. All modules operate at 10.3125 Gbps per channel over a recommended operating temperature range of −40 °C to 85 °C at ultra-low bit error rates of 10-12.
The low profile LightABLE™ 10G LM Series module (5 mm) is offered as a (4+4)-lane transceiver, a 12-channel transmitter, or a 12-channel receiver. The modules can be mounted directly upon a high-speed printed circuit board via surface mountable 1.27 mm pitch BGA or via a MEG-array connector. All modules operate at 10.3125 Gbps per channel over a recommended operating temperature range of −40 °C to 85 °C at ultra-low bit error rates of 10-12.
The LightABLE™ LH Series is a low profile optical transmitter or receiver that is offered as a 4 transmit or 4 receive lane (40G), or 12 transmit or 12 receive lanes (120G) in a parallel fiber configuration. These components can be mounted directly on a high-speed printed circuit board via surface mount technology or via a MEG-array connector. Hundreds of gigabits or even multiple terabits of optical connectivity can be directly delivered to within millimeters of an ASIC; bypassing the need for long copper traces and bulky pluggable optical modules.
The LightABLE™ 10G LA Series is a low profile optical transmitter or receiver that includes 12 transmit or 12 receive lanes in a parallel fiber configuration. These components can be mounted directly on a high-speed printed circuit board via surface mount technology or via a MEG-array connector. Hundreds of gigabits of optical connectivity can be directly delivered to within millimeters of an ASIC; bypassing the need for long copper traces and bulky pluggable optical modules.
The SNAP12 family of optical embedded transceivers are affordable, reliable, high-performance embedded optical transceivers with bandwidth up to 120 Gbps. These are well suited for high-bandwidth commercial aerospace systems with the added benefit of reducing aircraft wiring and system weight and bringing fault, EMI/EMC and lightning tolerance.
We offer a wide selection of multimode optical fibre cables and ribbons. Multimode fiber (50/125) is used and can be terminated in multiple styles (MT, MPO, etc.). Lengths of up to 300 m are offered. Custom cables and ribbons are available.
The proprietary MicroClip™ is a low-profile, low-mass spring loaded mechanical assembly that offers a rugged optical connection that is resistant for shock and vibration and is suitable for harsh environment.
The LightCONEX® series of optical plug-in and backplane module connectors for VPX systems is Smiths Interconnects’ answer to the stringent SWaP requirements of today’s defense applications in which fiber optics are replacing high bandwidth copper interconnects. This VPX series of active, blind-mate optical interconnects solution offers flexibility, light weight, very high bandwidth, and forward compatibility. The LightCONEX active blind-mate optical interconnect is a revolutionary solution for VPX systems that includes a fixed, plug-in module connector and a floating backplane connector compatible with proposed VITA 66.5 standard.
The LightCONEX® optical interconnect family includes plug-in and backplane module connectors that have been developed to be compliant with the forthcoming VITA 66.5 standard and in alignment with the SOSA™ technical standard. These active blind-mate optical interconnects are revolutionary solutions for VPX systems and meet the stringent SWaP requirements of today’s defense applications in which high-bandwidth fiber optic transceivers are replacing copper interconnects.
Smiths Interconnect is a leading provider of technically differentiated electronic components, subsystems, microwave and radio frequency products/thumbs that connect, protect and control critical applications in the commercial aviation, defense, space, medical, rail, semiconductor test, wireless telecommunications, and industrial markets.