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Global Capabilities

Smiths Interconnect’s in-house capabilities encompass design, development, manufacturing, and testing to respond quickly and accurately to customers’ needs and provide the most reliable connectivity solutions.



  • 3D EM Modelling
  • Advanced RF & System Modelling
  • CAD/CAM & Solid Modelling
  • Finite Element Analysis
    • Thermal Analysis
    • Shock & Vibration Analysis
  • Reliability Analysis


  • Precision Machine Shops
  • Connector, Contact, & Cable Assembly
  • Automated PCB Assembly & Inspection
  • Automated Hybrid Assembly
    • Die Placement
    • Wedge & Wire Bonding
    • Gap Welding
  • NASA-Certified Soldering
  • Automated Test & Tune
  • System Integration
  • Validation Testing


  • CNC turning and milling centers
  • Cabling / Prototype Assembly
  • 3D Printing
  • Ceramic Grinding
  • EDM
  • Circuit Board Routing


  • Electrical Acceptance & LOT Test
  • RF Test Capability, up to 110 GHz
  • High Speed Digital
  • Anechoic Chamber Testing
  • ESS Environmental Qualification
  • ESS Temperature, Shock & Vibration
  • Metallurgical 
  • Real Time X-Ray
  • Near Field/Compact Antenna Range
  • Thermal Vacuum
  • High Power RF Testing
  • Optics Lab
  • Multi paction, SRS mechanical shock
Click here for Product Test Reports