Skip to content

Global Capabilities

Banner Image ALT

Smiths Interconnect’s in-house capabilities encompass design, development, manufacturing, and testing to respond quickly and accurately to customers’ needs and provide the most reliable connectivity solutions.

  • Engineer at computer

    Engineering

    • 3D EM Modelling
    • Advanced RF & System Modelling
    • CAD/CAM & Solid Modelling
    • Finite Element Analysis
    • Thermal Analysis
    • Shock & Vibration Analysis
    • Reliability Analysis
  • Laboratory

    Manufacturing

    • Precision Machine Shops
    • Connector, Contact, & Cable Assembly
    • Automated PCB Assembly & Inspection
    • Automated Hybrid Assembly
      • Die Placement
      • Wedge & Wire Bonding
      • Gap Welding
    • NASA-Certified Soldering
    • Automated Test & Tune
    • System Integration
    • Validation Testing
  • Laboratory

    Prototyping

    • CNC turning and milling centers
    • Cabling / Prototype Assembly
    • 3D Printing
    • Ceramic Grinding
    • EDM
    • Circuit Board Routing
  • Computer

    Testing/Qualification

    • Electrical Acceptance & LOT Test
    • RF Test Capability, up to 110 GHz
    • High Speed Digital
    • Anechoic Chamber Testing
    • ESS Environmental Qualification
    • ESS Temperature, Shock & Vibration
    • Metallurgical 
    • Real Time X-Ray
    • Near Field/Compact Antenna Range
    • Thermal Vacuum
    • High Power RF Testing
    • Optics Lab
    • Multi paction, SRS mechanical shock

    Click here for Product Test Reports