Smiths Interconnect’s test socket and probe card solutions utilize IDI contact technology to ensure superior quality and reliability in semiconductor test applications. Our best-in-class engineering, development and technical expertise ensure support of automated, system level and development test platforms.
We foster a Culture of Quality to be the best at what we do ... Quality, it is all about the Customer.
In-house capabilities encompass design, development, manufacturing and testing. Providing operational excellence tailored to volume manufacturing requirements, global sourcing, world class engineering talent and rapid prototyping.
The innovative socket design allows for disassembly of housing without removing from the PCB during cleaning or repairing, which results in higher production throughput and reduced down time. Joule 20’s redundant contact technology provides repeated reliable DUT contact whether Matte Tin or NiPdAu, without damage to the PCB.
IC developers are increasingly integrating functionalities within a single package, escalating the complexity of test. Higher speed digital and analog devices are being manufactured at record volumes and the need for high performance testing has never been greater. The DaVinci Series Test Socket is a high performance coaxial socket developed for reliable IC testing up to 67GHz Analog RF & 56Gbps NRZ Digital, a patented design integrating spring probe technology and a proprietary insulated housing material.
Highly precised top and bottom array simultaneous test capable socket for effective package on package test. Customized socket design is capable to test high speed signals in lab, engineering, SLT and ATE applications. Controlled impedance loop-back with PCB for high speed signal integrity.
Highly reliable multi site strip test socket . Customized design to suite any strip test handler. High parallelism offers higher throughput.
5A continues current carrying capacity and capable -50 to 170deg C test environment. Proprietary contact design with wiping action at device pad to ensure consistent contact resistance. Minimal scrub action to the PCB pad.
Extremely short signal path and capable to handle >40GHz. Customized test socket design for lab, engineering, SLT and ATE tests.
Customized test sockets for any IC packages. Suitable for lab, Engineering, SLT & ATE test application. Wide selection of Smiths Interconnects spring pins with low and stable contact resistance. World class design, Lab and manufacturing facility to ensure consistence product performance with highest customer satisfaction. Highly competitive price and global support.
Smiths Interconnect offers high value Thermal Management Lid capabilities including air-chilled or liquid cooled technology, capable of dissipating up to 650 Watts. Our solutions are developed to be compatible with existing test hardware footprints for simple integration, reducing test set-up time and overall cost.
Galileo is an innovative, low-profile test socket that provides outstanding electrical and mechanical performance for IC test customers who need a cost effective, rapid delivery solution. Combining a universal interconnect fabric material with advanced 3D manufacturing processes, Galileo enables low-volume, rapid turn-around-time production of test sockets for a wide variety of IC test applications.
An innovative and robust spring probe technology for Kelvin contact applications down to 0.25mm pitch. The product’s unique chisel tip provides reliable, stable contact resistance for critical applications such as loT, Automotive where test performance cannot be sacrificed.
The Volta Series Probe Head addresses a need for reduced test time set-up and increased throughput in high reliability testing of Wafer Level Packages (WLP), Wafer Level Chip Scale Packages (WLCSP) and Known Good Die (KGD) at 180 µm pitch and higher.
Smiths Interconnect is a leading provider of technically differentiated electronic components, subsystems, microwave and radio frequency products that connect, protect and control critical applications in the commercial aviation, defense, space, medical, rail, semiconductor test, wireless telecommunications, and industrial markets.