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Semiconductor Test


Smiths Interconnect’s test socket and probe card solutions utilize IDI contact technology to ensure superior quality and reliability in semiconductor test applications. Our best-in-class engineering, development and technical expertise ensure support of automated, system level and development test platforms.

Semiconductor Test
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We foster a Culture of Quality to be the best at what we do ... Quality, it is all about the Customer.

Smiths Interconnect Capabilities


In-house capabilities encompass design, development, manufacturing and testing. Providing operational excellence tailored to volume manufacturing requirements, global sourcing, world class engineering talent and rapid prototyping.

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Array High Speed Test - DaVinci 112

The DaVinci 112 test socket extends the 'DaVinci’ Series with an innovative solution for testing the most complex functionality of ASICs (Application Specific Integrated Circuits).

Array High Speed Test - DaVinci Micro Test Socket

DaVinci Micro fully shielded signal path negates the effects of cross-talk during test, allowing an immediate yield enhancement over non-DaVinci products.

Array High Speed Test - DaVinci Series

IC developers are increasingly integrating functionalities within a single package, escalating the complexity of test.  Higher speed digital and analog devices are being manufactured at record volumes and the need for high performance testing has never been greater.  The DaVinci Series Test Socket is a high performance coaxial socket developed for reliable IC testing up to 67GHz Analog RF & 56Gbps NRZ Digital, a patented design integrating spring probe technology and a proprietary insulated housing material.

Array PoP Test

Highly precised top and bottom array simultaneous test capable socket for effective package on package test. Customized socket design is capable to test high speed signals in lab, engineering, SLT and ATE applications. Controlled impedance loop-back with PCB for high speed signal integrity.

Galileo Test Socket

Galileo is an innovative, low-profile test socket that provides outstanding electrical and mechanical performance for IC test customers who need a cost effective, rapid delivery solution. Combining a universal interconnect fabric material with advanced 3D manufacturing processes, Galileo enables low-volume, rapid turn-around-time production of test sockets for a wide variety of IC test applications.

Kepler Test Socket

The Kepler contact technology combines the scrub motion of a cantilever contact with the versatility and modularity of a spring probe.

Peripheral Strip Test

Highly reliable multi site strip test socket . Customized design to suite any strip test handler. High parallelism offers higher throughput.

Peripheral Tri-Temp Test

5A continues current carrying capacity and capable -50 to 170deg C test environment. Proprietary contact design with wiping action at device pad to ensure consistent contact resistance. Minimal scrub action to the PCB pad.

Silmat® Elastomeric Test Socket

Extremely short signal path and capable to handle >40GHz. Customized test socket design for lab, engineering, SLT and ATE tests.

Standard Array & Peripheral Test

Customized test sockets for any IC packages. Suitable for lab, Engineering, SLT & ATE test application. Wide selection of Smiths Interconnects spring pins with low and stable contact resistance. World class design, Lab and manufacturing facility to ensure consistence product performance with highest customer satisfaction. Highly competitive price and global support.

Thermal Management Lid Capabilities

Smiths Interconnect offers high value Thermal Management Lid capabilities including air-chilled or liquid cooled technology, capable of dissipating up to 650 Watts.  Our solutions are developed to be compatible with existing test hardware footprints for simple integration, reducing test set-up time and overall cost.

Kelvin Probes Solution

An innovative and robust spring probe technology for Kelvin contact applications down to 0.25mm pitch. The product’s unique chisel tip provides reliable, stable contact resistance for critical applications such as loT, Automotive where test performance cannot be sacrificed.

Volta Series Probe Head

The Volta Series Probe Head addresses a need for reduced test time set-up and increased throughput in high reliability testing of Wafer Level Packages (WLP), Wafer Level Chip Scale Packages (WLCSP) and Known Good Die (KGD) at 180 µm pitch and higher.

C-Series H-Pin® Socket

C Series Socket is a modular burn-in socket with clamshell-style lid. The small footprint outline allows for a best-in-class range of package accommodations, from 0.5 mm body size up to 12 mm and optimal socket density per burn-in board.

D Series H-Pin® Socket

D-Series Socket is a performance burn-in socket, with a clamshell-style lid that can be equipped with a heater and thermal sensor.

ES Series H-Pin® Socket

ES family Series of sockets extended the scope of a burn-in socket. The modular lid construction can handle up to 1 kW of power and is optimized with thermal simulation to ensure out-of-the-box performance whether liquid or air cooled. 

ES Micro Series H-Pin® Socket

ES Micro Series Socket is a technological advancement in the burn-in socket segment, with a dual latch clamshell lid to provide co-planar pressure on the DUT when the lid is actuated. The inclusion of the patented H-Pin contact technology in the ES Micro-Series socket provides market-leading electrical performance in the smallest footprint for the highest possible parallelism on a burn-in board. This series is compatible with standard heaters and temperature sensors.

ESJ Series H-Pin Socket

ESJ Series socket is a high-performance burn-in socket, with dual latch clamshell lid to provide co-planar pressure on the DUT when the lid is actuated.

K Series H-Pin® Socket

The K-Series socket is designed to apply flat even pressure on the DUT with a secondary lever once the lid has been closed. This is to ensure that the platen does not skid across the top of the device when closing the lid potentially marking the device. This is especially important for exposed die products, or automotive applications where appearance is part of the pass/fail acceptance criteria post test.

M-Series H-Pin® Socket

M Series socket has long been the gold standard for reliability and out-of-the-box performance burn-in sockets. The high-quality components have been refined and enhanced over their lifetime for optimum performance and the highest quality.


These sockets offer a modular design in a small outline with very low inductance. The new Open Top QFN socket allows for more convenient package loading and unloading in most of the same lead count options as the lidded version.

Q-Series H-Pin® Socket

The Q-Series socket is available for mid to large package sizes. The Q-Series is a fully molded socket body and lid designed to meet the rigors of a wide variety of accelerated life testing applications.

R-Series H-Pin® Socket

The R-Series product line is an open-top reliability socket used for accelerated life testing. With versions of the compression mount open-top design available as a drop-in replacement for other legacy products on the market, there is no need to purchase new burn-in boards.

ESJ Series H-Pin® Socket

ESJ Series socket is a high-performance burn-in socket, with dual latch clamshell lid to provide co-planar pressure on the DUT when the lid is actuated.


The H-Pin is a stamped spring probe with the mechanical, electrical, and thermal performance of a spring probe, and the ease of use and high volume manufacturability of a stamped contact. The H-Pin serves applications without the typical compromises that are generally required when considering cost versus performance.

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Who We Are

Smiths Interconnect is a leading provider of technically differentiated electronic components, subsystems, microwave and radio frequency products that connect, protect and control critical applications in the commercial aviation, defense, space, medical, rail, semiconductor test, wireless telecommunications, and industrial markets.

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