Smiths Interconnect’s test socket and probe card solutions utilize IDI contact technology to ensure superior quality and reliability in semiconductor test applications. Our best-in-class engineering, development and technical expertise ensure support of automated, system level and development test platforms.
In-house capabilities encompass design, development, manufacturing and testing. Providing operational excellence tailored to volume manufacturing requirements, global sourcing, world class engineering talent and rapid prototyping.
We foster a Culture of Quality to be the best at what we do ... Quality, it is all about the Customer.
Highly precised top and bottom array simultaneous test capable socket for effective package on package test. Customized socket design is capable to test high speed signals in lab, engineering, SLT and ATE applications. Controlled impedance loop-back with PCB for high speed signal integrity.
Controlled impedance socket using individually replaceable spring pins. Socket is built with proprietary insulated metal with least deflection to accommodate large IC packages. Low and stable contact resistance and 3A current carrying capacity per pin. 40GHz/26Gbps performance.
Customized test sockets for any IC packages. Suitable for lab, Engineering, SLT & ATE test application. Wide selection of Smiths Interconnects spring pins with low and stable contact resistance. World class design, Lab and manufacturing facility to ensure consistence product performance with highest customer satisfaction. Highly competitive price and global support.
Highly reliable multi site strip test socket . Customized design to suite any strip test handler. High parallelism offers higher throughput.
5A continues current carrying capacity and capable -50 to 170deg C test environment. Proprietary contact design with wiping action at device pad to ensure consistent contact resistance. Minimal scrub action to the PCB pad.
Extremely short signal path and capable to handle >40GHz. Customized test socket design for lab, engineering, SLT and ATE tests.
Smiths Interconnect offers high value Thermal Management Lid capabilities including air-chilled or liquid cooled technology, capable of dissipating up to 650 Watts. Our solutions are developed to be compatible with existing test hardware footprints for simple integration, reducing test set-up time and overall cost.
Proprietary embedded barrel spring pin technology allows the best in class electrical and mechanical performance. Higher parallelism for greater throughput. Individually replaceable cartridge design allows minimal downtime. Optimized design of Fan out PCB to insure best signal integrity.
The Volta Series Probe Head addresses a need for reduced test time set-up and increased throughput in high reliability testing of Wafer Level Packages (WLP), Wafer Level Chip Scale Packages (WLCSP) and Known Good Die (KGD) at 200 µm pitch and higher.
Smiths Interconnect is a leading provider of technically differentiated electronic components, subsystems, microwave and radio frequency products that connect, protect and control critical applications in the commercial aviation, defense, space, medical, rail, semiconductor test, wireless telecommunications, and industrial markets.