High Performance Probe Heads

Features & Benefits

The unique precision afforded by Smiths Interconnect's floating spring probe designs allows for seamless deployment in testing Wafer Level Chip Scale Packages. We work closely with our customers to develop contactors which are used as probe heads in place of cantilever and traditional vertical probe card technologies. Smiths Interconnect has created thousands of probe heads for every type of device and prober. In that process, we have created a WLCSP-optimized family of spring contact probes, the Volta Series.

Reliable RF signal integrity
Excellent compliance and contact force
Easy maintenance

Specifications

		Volta 180	Volta 200	Volta 250	Volta 300	Volta 350	Volta 400
Wafer I/O Pitch		180 μm	200 μm	250 μm	300 μm	350 μm	400 μm
Minimum Probe Depth (At Test)		2.85 mm	2.85 mm	2.90 mm	3.80 mm	3.50 mm	2.90 mm
Probe Travel	Wafer Side	230 μm	230 μm	250 μm	250 μm	300 μm	300 μm
Probe Travel	PCB Side	170 μm	170 μm	150 μm	150 μm	150 μm	150 μm
Spring Material		music wire	music wire	music wire	stainless steel	stainless steel	stainless steel
Device Side Contact Material		Homogenous
Probe Tip Shape		4-Point Crown
Spring Force		6.5 gf	10 gf	15 gf	17.5 gf	16 gf	17 gf
Contact Resistance		< 200 mΩ	< 250 mΩ	< 100 mΩ	< 100 mΩ	< 70 mΩ	< 50 mΩ
Continuous Current Carrying Capacity (Room Temp.)		0.84 A	1.2 A	1.5 A	2 A	2.50 A	3 A
Insertion Loss (Pattern: R-S-R @ -1 dB)		20 GHz	22 GHz	30 GHz	20 GHz	20 GHz	20 GHz
Loop Inductance		0.65 nH	0.56 nH	0.76 nH	0.95 nH	0.92 nH	0.82 nH
Capacitance		0.40 pF	0.22 pF	0.31 pF	0.39 pF	0.41 pF	0.30 pF
Working Temperature		-55° to120°C	-55° to 120°C	-55° to 120°C	-55° to 150°C	-55° to 150°C	-55° to 150°C
Max. Number of Test Sites		Defined by the FEA [Total pin count at a defined area is the limit]
Sorted Die Test Feature (Alignment Plate and Manual Actuator)		Yes
Individual Contact Replacement		Yes

Documents & Literature

Brochure

Volta Series Probe Head Brochure (A4)

757 kB

Volta Series Probe Head Brochure (US)

771 kB

Case Study

Increasing Digital Reliability

As computers, mobiles and smart devices become more advanced, so must the integrated chips that support them. Smiths Interconnect’s new Volta semiconductor test solutions, are leading the way. These solutions are used for testing the integrated chip packages behind everything from Bluetooth and power management to digital displays. Volta significantly outperforms the competition in both durability and performance.

Learn More