Features & BenefitsThe unique precision afforded by Smiths Interconnect's floating spring probe designs allows for seamless deployment in testing Wafer Level Chip Scale Packages. We work closely with our customers to develop contactors which are used as probe heads in place of cantilever and traditional vertical probe card technologies. Smiths Interconnect has created thousands of probe heads for every type of device and prober. In that process, we have created a WLCSP-optimized family of spring contact probes, the Volta Series. Reliable RF signal integrity Excellent compliance and contact force Easy maintenance This media type is not supported by your browser.
Specifications Volta 180 Volta 200 Volta 250 Volta 300 Volta 350 Volta 400 Wafer I/O Pitch 180 μm 200 μm 250 μm 300 μm 350 μm 400 μm Minimum Probe Depth (At Test) 2.85 mm 2.85 mm 2.90 mm 3.80 mm 3.50 mm 2.90 mm Probe Travel Wafer Side 230 μm 230 μm 250 μm 250 μm 300 μm 300 μm PCB Side 170 μm 170 μm 150 μm 150 μm 150 μm 150 μm Spring Material music wire music wire music wire stainless steel stainless steel stainless steel Device Side Contact Material Homogenous Probe Tip Shape 4-Point Crown Spring Force 6.5 gf 10 gf 15 gf 17.5 gf 16 gf 17 gf Contact Resistance < 200 mΩ < 250 mΩ < 100 mΩ < 100 mΩ < 70 mΩ < 50 mΩ Continuous Current Carrying Capacity (Room Temp.) 0.84 A 1.2 A 1.5 A 2 A 2.50 A 3 A Insertion Loss (Pattern: R-S-R @ -1 dB) 20 GHz 22 GHz 30 GHz 20 GHz 20 GHz 20 GHz Loop Inductance 0.65 nH 0.56 nH 0.76 nH 0.95 nH 0.92 nH 0.82 nH Capacitance 0.40 pF 0.22 pF 0.31 pF 0.39 pF 0.41 pF 0.30 pF Working Temperature -55° to120°C -55° to 120°C -55° to 120°C -55° to 150°C -55° to 150°C -55° to 150°C Max. Number of Test Sites Defined by the FEA [Total pin count at a defined area is the limit] Sorted Die Test Feature (Alignment Plate and Manual Actuator) Yes Individual Contact Replacement Yes
Documents & Literature BrochureVolta Series Probe Head Brochure (A4)757 kBVolta Series Probe Head Brochure (US)771 kB
Case Study Increasing Digital Reliability As computers, mobiles and smart devices become more advanced, so must the integrated chips that support them. Smiths Interconnect’s new Volta semiconductor test solutions, are leading the way. These solutions are used for testing the integrated chip packages behind everything from Bluetooth and power management to digital displays. Volta significantly outperforms the competition in both durability and performance. Learn More