• June 05, 2026

Discover how modular connectors simplify electronics design in harsh environments by combining power, signal and data in one high-reliability solution.

• May 05, 2026

Power connectors are a critical weak point in high‑current battery systems. Discover how advanced hyperboloid contact technology reduces power loss, heat and reliability risks in demanding applications.

• March 10, 2026

Uncover the benefits of Ceramic RF Filters in mission-critical applications. Get insights on choosing the right filter for superior performance and efficiency.

• January 16, 2026

The landscape of high-speed radio frequency (RF) interconnects is continuously evolving, driven by the need for enhanced performance, simplified assembly, and improved durability. For decades, the Subminiature Push-On (SMP) connector has been a staple in many RF applications. However, a new, solder-less, spring-loaded solution, EZiCoax, offers significant advantages over traditional SMP contacts, particularly in complex, board-to-board architectures.

• By Joydip Sanyal and Chiara Pieri
• January 02, 2026

When working on high-voltage DC power transmission projects, most engineers focus on sizing batteries and cables correctly. However, the surprising reality is that connectors often represent the key link in the system.

• June 03, 2025

From enabling communication in deep space to ensuring the reliability of equipment in harsh environments, Smiths Interconnect’s components have played an integral role in advancing our understanding of the universe.

• April 21, 2025

In today’s high-frequency applications, maintaining signal integrity is crucial for optimal system performance. Smiths Interconnect’s Fixed Attenuators – Small Signal products are designed to provide precise signal attenuation, ensuring reliable and stable performance in critical industries such as aerospace, space, defense, and telecommunications technology.

• March 26, 2025

This blog post will cover Smiths Interconnect's specialized medical cable assemblies, highlighting their features like biocompatibility and sterilization compatibility, and showcasing their applications in various medical fields. It will also delve into their quality standards and innovative solutions for advanced medical technologies.

• February 19, 2025

Ruggedizing cables can help extend the life and increase performance of RF cables. Mission-critical systems are exposed to different harsh environments, providing a high-quality RF/microwave transmit signal is crucial for electrical systems.

• February 10, 2025

Smiths Interconnect’s diverse range of technology brands represents the pinnacle of engineering and technological innovation. Each technology brand brings its unique expertise to the table, collectively contributing to the advancement of industries ranging from aerospace and defense to telecommunications and medical markets.

• February 03, 2025

As the demand for consumer electronics, AI-driven technologies, and high-performance computing rebounds, Smiths Interconnect is poised for growth. Innovations in large package sizes, high pin counts, and power consumption optimization in GPUs, CPUs, and HPCs position the company as a leader in the next generation of semiconductor testing solutions.

• January 24, 2025

Julian Fagge introduces our latest Engineering Explained on the Europa Clipper mission

• November 27, 2024

November 27th, 2024 marks the anniversary of Smiths Interconnect's award from the UK Space Agency’s Space Clusters Infrastructure Fund (SCIF), where we secured funding to advance our capabilities in the space industry.

• September 04, 2024

The DaVinci 112 is specifically engineered to handle the advanced requirements of today's most dynamic markets, including Cloud Computing, Data Centers, Artificial Intelligence, and Connected Automotive.

• August 12, 2024

The impressive outcome of the trial not only attracted a major new contract, but also match-funding from the UK Space Agency that’s now enabling the establishment of a £3.8m single-site CAD-to-FAB facility in Dundee.

• By Julian Fagge
• June 24, 2024

Smiths Interconnect is one of Smiths Group’s four businesses. We have a truly global reach, with sites in locations around the world including Mexico, Italy, North America, China, and the UK.

• By Federica Nappi
• April 08, 2024

As our world becomes increasingly interconnected, the demand for faster and more reliable connectivity solutions continues to surge. Enter high-speed data connectors – the unsung heroes powering the backbone of our digital infrastructure.

• By Mike Schweyer
• March 13, 2024

In the space and defense industry, the requirements for RF filters are stringent due to the demanding environments and critical applications they serve. RF filters are commonly used in space and defense applications for several reasons.

• March 04, 2024

To meet the demands of mission-critical applications, Smiths Interconnect offers a comprehensive range of backplane connectors, known for their performance and reliability.

• February 26, 2024

The electronic system development supply chain that has become increasingly diverse and global, with components provided from various regions around the world. This comes with several challenges including variability in supply and demand, geopolitical tensions and unforeseen events that may lead to delays, increased costs and supply chain inefficiencies.

• By Joydip Sanyal and Chiara Pieri
• February 08, 2024

The mine of the future is being built on connectivity of data and automation. The benefits of Industry 4.0 through digitalization of data from connected assets in the mining industry is profound. To enable near-real time decision, a digital mine needs to bring together data from across its assets distributed within its value chain. If done correctly, it rewards the industry with increasing uptime of critical assets, reducing costs and operational risks.

• By Dave Raymond
• February 05, 2024

HR TSX Series represents a significant leap forward in the realm of high-frequency surface mount chip attenuators. Its combination of small form factor, robust construction, and versatile performance make it an attractive choice for space and defense applications.

• By Thomas Ducellier
• January 10, 2024

The space qualification laboratory plays a pivotal role in simulating the harsh conditions of space, ensuring the quality and durability of space components.

• By Federica Nappi
• December 11, 2023

Central to the C9394 Series is its outstanding capacity, boasting an impressive 450 ways per module. This high-density design allows engineers and manufacturers to optimize space on printed circuit boards (PCBs) without compromising performance.

• By Chiara Pieri
• December 04, 2023

In the realm of medical technology, where precision and innovation intersect, the quest for excellence becomes an unyielding pursuit. When dealing with the design of interconnect systems for the medical industry, the level of engineering attention and engagement required to develop a top performance product is very high.

• By Kevin Koontz
• November 27, 2023

After over 40 years of industry experience, Plastronics was acquired by Smiths Interconnect as the company’s one-stop shop for burn-in and reliability testing. As the complementary in-house burn-in division, we have also brought a wealth of knowledge and expertise in socket design and manufacturing.

• November 13, 2023

Smiths Interconnect recognizes the critical importance of connectivity in the realm of space technology and is proud to present the SpaceNXT™ Range - a groundbreaking initiative that offers pre-tested and qualified interconnect solutions for the next generation of space applications.

• By Kevin Koontz
• November 01, 2023

Not every semiconductor manufacturer utilizes thermal simulation in their reliability testing setup. Lower power burn-in allows for an acceptable temperature rise within the package/die in a traditional burn-in chamber running at 125°C. As packages in burn-in are moving to higher power output, socket and burn-in systems may need to have enhanced features to manage the desired target die temps.

• By Steve Carnegie
• October 23, 2023

To extend the life of your probes and lower the overall cost of testing, consider the following steps.

• By Dave Raymond
• October 10, 2023

In the realms of space exploration and defense technology, electronic components play a pivotal role in ensuring mission success and national security. Among these components, fixed attenuators stand out as essential tools for signal management, maintaining the integrity of electronic systems amidst the most challenging environments

• By Chiara Pieri
• October 04, 2023

With the growing popularity of portable and patient-wearable devices, the size and weight of connectors have suddenly taken center stage in the medical sector.

• September 19, 2023

Space missions expose electronic components to intense radiation, a challenge that can compromise the functionality of conventional devices. However, Smiths Interconnect's SpaceABLE® line of products is purposefully designed to withstand these extreme conditions.

• By Tim Wooden
• September 01, 2023

Where best-in-class electrical requirements intersect with a need for a small outline, low-profile footprint, IC designers are increasingly migrating to QFN packages. Meeting these testing challenges requires a test socket solution that is robust, reliable, and electrically “clean.”

• By Steve Durrett
• August 07, 2023

When companies develop new devices, they must ensure there are no failures in the field. This means that thorough reliability burn-in testing must take place from the start to avoid malfunctions down the road.

• July 14, 2023

The X-Band cutoff frequency range is from 8 GHz to 12 GHz with a wavelength of 3.8 to 2.5 cm.

• By Steve Durrett
• June 21, 2023

The tech zeitgeist is all about the extreme. The more advanced our devices become by the day, the more they evolve – and consumers’ expectations with them.

• May 08, 2023

Space flight hardware is exposed to severe shock, vibration, thermal variations and electromagnetic environments that start with launch and continue throughout its operational lifetime. Environmental tests expose the hardware to these environments in a simulation laboratory to validate the design, screen for manufacturing defects and ensure the reliability and survivability of flight hardware.

• By Steve Durrett
• May 01, 2023

Burn-in testing is widely used as an aid in producing failure-free electronic components. When scientifically planned and conducted, burn-in-testing sockets offer one of the most effective methods of reliability screening at the component level. Testing during production plays a vital role in ensuring reliability and repeatability. Semiconductor manufacturing plants perform tests at each stage of production to eliminate defective parts as early as possible while precisely controlling each process parameter of the chip.

• By Andy Breslin and Tim Meehan
• April 24, 2023

Guidelines for maintaining cables and connectors.

• By Steve Durrett
• April 05, 2023

Creating more compact electronic components with higher functionality is a challenge for all electronics manufacturers. Whatever industry you're in, creating consumer, business, or military-grade electronics, the challenge presents itself, and the stakes are high. As electronics are expected to continue shrinking while increasing capabilities, blind mating connectors are required to meet those same size and functionality requirements.

• April 03, 2023

A coaxial circulator is a passive, non-reciprocal three-port device that allows microwave or radio-frequency signal to exit through the port directly after the one it entered. An isolator is a two-port device that transmits microwave or radio frequency power in one direction only, while the other direction is blocked. Isolators can be considered as a special case of circulators and are made by suitably terminating one port of the circulator ports.

• By Steve Durrett
• March 13, 2023

Plastronics, a Smiths Interconnect technology brand, is a global provider of innovation for semiconductor reliability testing, meeting the industry’s burn-in socket needs for more than 40 years. It all started when our company invented the first open-top, application-specific socket for production burn-in of LCC packages. This innovation helped semiconductor manufacturers significantly increase their throughput and decrease costs.

• By Steve Durrett
• February 14, 2023

Tiny computers, smartphones, and small electronic devices that industry leaders and other companies have popularized are forcing the hand of semiconductor package designers to shrink the package to fit within these little hand-held gadgets. The demand for technology applications, such as smart homes, smart manufacturing, smart medical care, and automotive electronics, continues to increase. At the same time, the requirements of continuous miniaturization and functional diversification of electronic product demands also increase.

• By Federica Nappi
• January 03, 2023

Space satellites market is evolving from RF Analog-based payloads providing low speed telecommunication signaling, to a new Digital Transparent Processor architecture for high throughput satellites. This type of architecture increases the demand for rugged and higher speed connectivity.

• By Chiara Pieri
• December 02, 2022

Autoclaving is often used to sterilize medical devices to prevent disease transmission both in new and reusable products. Autoclaves sterilize by introducing high pressure steam into a chamber containing the objects to be sterilized. Therefore, these devices must be able to withstand autoclaving temperatures in the range of 135°C without damage, deformation, or disintegration.