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Smiths Interconnect Blog

Keep up to date on the latest updates and industry insights with Smiths Interconnect

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83 Results

  • Custom Grid Array
    07 Nov

    Spring Probe based Pin Grid Arrays (PGAs) for MRI Applications

    • By Robert Friedt and Chiara Pieri
    • November 07, 2022

    Spring probes offer high density and have a very high mating cycle life, often higher than traditional pin & socket contact systems, and this is needed to keep very expensive MRI systems operating to their full capacity and patient throughput to a maximum.

  • Ensure Reliability in Edge Computing with Burn-In Testing
    01 Nov

    Ensure Reliability in Edge Computing with Burn-In Testing

    • By Steve Durrett
    • November 01, 2022

    Retail. Manufacturing. Government. Healthcare. Distribution. Choose an industry, and edge computing is there helping organizations thrive. Every industry has more data to generate, control, share, and save, which means that through 2022 and beyond, more enterprises will use the edge to benefit their business.

  • L Series Connectors
    20 Oct

    Customizable modular connectors for demanding therapeutic devices

    • October 20, 2022

    Modern therapeutic systems for the treatment of weight loss for both health and aesthetic purposes are evolving to help people live a better life. To achieve the necessary results, medical devices need to ensure long-lasting, constant and high-level performance with reliable components able to support harsh conditions.

  • LightCONEX®
    10 Oct

    The next step in optical interconnectivity for the defense industry

    • By Arlen Martin and Jon Lundberg
    • October 10, 2022

    Optical interconnectivity has a significant impact on the defense industry. Not only does it allow greater amounts of data to be passed over longer distances, but it also minimizes SWaP (size, weight, and power) relative to copper alternatives. In fact, cabling weight can be reduced more than 90% with no interference and carry high-speed data 15 to 20 times further.

  • Custom Connectors VS Catalog Connectors: Benefit Breakdown and Challenges
    05 Sep

    Custom Connectors VS Catalog Connectors: Benefit Breakdown and Challenges

    • By Steve Durrett
    • September 05, 2022

    There's no escaping the expectations to create more compact electronic components with higher functionality. Designing shrinking electronics is a challenge for all electronics manufacturers. Whatever industry you're in and no matter if you’re creating consumer, business, or military-grade electronics, there is a demand for building smaller, smarter, and sturdier electronics.

  • TSX Attenuators
    23 Aug

    Small but mighty: How attenuators benefit defense and space industries

    • By Dave Raymond and Tim Meehan
    • August 23, 2022

    Current space and defense industries are putting pressure on electronic manufacturers to deliver high performance with smaller form factor. For applications in these industries, from radios to drones and satellites, miniaturizing components such as RF chip attenuators with broad frequency ranges is becoming critical for developing technology and meeting the challenging demands of defense and space applications.

  • Representative Test Socket: DaVinci High Speed Test Socket
    08 Aug

    Is it really that hard to improve chip test performance?

    • By Susan Su
    • August 08, 2022

    In the digital era, semiconductor chips are present in almost every aspect of our lives. Whether it is from microwave ovens to computers, cell phones, computer central processing units, and other electronic devices there are a variety of chips installed.

  • C Series Connectors
    06 Jun

    How connectivity can play a key role in rail braking systems

    • By Chiara Pieri
    • June 06, 2022

    Train deceleration is a key function that implies passengers’ safety, environment and property protection and nothing can be left to chance or neglected when it is the moment to select the right parts that have to compose the brake system. With this in mind, the design engineers have to pay attention to reduce the overall maintenance costs as well to provide a dependable and market aligned solution.

  • HBB Five Pole
    18 May

    High five for new HBB circular connectors

    • By Gregory Kay
    • May 18, 2022

    Smiths Interconnect’s new HBB five-pole connector packs flexibility, reliability and safety as well as power into one easy-to-use connector for demanding applications. We’ve built an international reputation on our ability to anticipate customers’ future needs and innovate to meet them. In the defense sector, we’ve been exploring the potential of the energy revolution for combat vehicles, both on the ground and in the air.

  • Enhanced rating for KA connectors
    26 Apr

    Enhanced ratings for KA connectors

    • April 26, 2022

    Our popular KA Series PCB connectors are capable of performing to significantly higher levels than the conservative ratings to date might suggest.

  • How Rail electrification can contribute to emissions reduction
    10 Jan

    How Rail electrification can contribute to emissions reduction

    • By Joydip Sanyal and Chiara Pieri
    • January 10, 2022

    The great impetus given by the COP26 summit has raised the world's awareness of climate change and made it a global priority. It is today well-known that to halt the consequences of climate change we need to limit global warming to 1.5°C (34.7°F) above pre-industrial levels. As a result, all aspects of our lives are under scrutiny.

  • One World Web Coverage
    02 Feb

    The Internet of Space and radiation resistant transceivers

    • February 02, 2021

    The explosion of worldwide communications over the past 25 years has led to the pervasive use of mobile and land communications equipment with an abundance of platforms, applications, and devices all driving the growth of many of the largest businesses in the world. There is no doubt that this trend will continue through the Internet of Things (IoT), and the arrival of the 5G technology along with improvements to the underlying network infrastructure. However, the next, ‘Small Step’ for man in terms of ubiquitous communications will be the ‘Giant Leap’ into the Internet of Space.

  • WCLSP Testing
    14 Dec

    Accelerating Device Bring-Up and Production Ramp for WLCSP 5G Mobile IC’s

    • By Rick Marshall
    • December 14, 2020

    As mobile phone electronics continue to shrink, WLCSP has become the de-facto packaging solution for IC’s going into today’s flagship handsets. Manufacturers need solutions to rapidly debug their new silicon, and quickly ramp it to HVM while achieving aggressive DPPB quality levels.

  • Space Missions
    03 Jun

    Expanding the Frontier

    • By Roberta Rebora
    • June 03, 2020

    As Space Missions evolve, so do Smiths Interconnect’s light and compact connectivity solutions.

  • rail mobility
    22 Jan

    The evolution of rail mobility and where the performance of components is critical.

    • By Chiara Pieri
    • January 22, 2020

    The request for faster, safer and more comfortable services has grown proportionally in the rail industry over the recent years and the last two decades have seen exponential growth in the use of technology towards the evolution of very sophisticated transport system where the performance of components is more and more critical.

  • Optical interconnect for high-speed, high- bandwidth 10GigE and 40GigE cameras used in machine vision.
    27 Jun

    Taking the Fast Bridge between Neural Networks

    • By Lynnette Reese,
    • June 27, 2019

    Neural networks have been around since the 1950s. The advent of fast, massively parallel processors like the Graphics Processing Unit (GPU) have made neural network applications like object recognition feasible. Neural networks are one means used to create Artificial Intelligence (AI). The latest iPhones now have an AI chip, primarily to offload face recognition tasks.1 Voice translation tasks would also benefit from an AI chip. Google provides voice translation as long as there is access to a cloud. The ability to translate directly from a phone without requiring Internet access to Google engines would be advantageous, and it’s possible that the iPhone is headed in that direction.

  • 3U and 6U OpenVPX carrier cards for XMC , PMC and AcroPack I/O mezzanine modules (courtesy Acromag)
    16 Jun

    VPX Technology Development Trends

    • By John Koon
    • June 16, 2019

    Security is a critical challenge for a wide range of embedded systems applications. System integrators must optimize operational capability, maximize competition for systems development, ensure interoperability, and maintain commonality to reduce life-cycle cost.

  • BGA electrical interface
    03 Jun

    Understanding the Test Criteria of Optical Fiber Transceivers Used in Space

    • By Jocelyn “Justin” Lauzon,
    • June 03, 2019

    In space, high performance components must be able to deliver reliably in the punishing environment. It is optical transceivers that drive transmissions, converting signals to and from a copper-resident format. Fiber optics communications provide high bandwidth and low latency signaling. Signal transmissions through fiber optic cables (FOCs) provide immunity to EM/RFI interference, crosstalk, and voltage level surges. Fiber optics’ accuracy and reliability exceeds traditional cabling. Covering 1,000 feet requires four pounds of FOC versus 39 pounds of copper wiring, and fiber optics also consume less energy than copper. To convert electrical signals from circuitries with copper output to fiber optics, optical fiber transceivers are usually required.

  • LightCONEX_43
    01 Nov

    Overcome Challenges in Embedded Optical Interconnects Design

    • By Gerald Persaud and David Rolston
    • November 01, 2018

    The above article has outlined the advantages and challenges of using fiber optical interconnects. To use fiber optic cables, the electrical signals need to be converted to light signals using fiber optic transceivers. While there are many challenges to embedded fiber optics design, the benefits are substantial. The guidelines and design check list provided will help developers select the best solutions for their needs.

  • Space Flare
    23 Sep

    Optical Interconnect Design Challenges in Space

    • By Guillaume Blanchette, David Rolston
    • September 23, 2018

    Aeronautical applications face many design challenges that are unique to their intended environment. The best practices for optical interconnect design for space applications include the use of radiation-resistant technology to defend against space radiation, the use of components and devices that are designed to operate in harsh environments, and meeting size, weight, and power (SWaP) and long-term reliability requirements. Finally, it is recommended to follow open standards like VPX and to look for solutions that comply with MIL and quality standards.