A stamped spring probe with the mechanical, electrical, and thermal performance of a spring probe, and the ease of use and high volume manufacturability of a stamped contact.
C-Series H-Pin® Socket
Modular burn-in socket with clamshell-style lid. Range of package accommodations, from 0.5 mm body size up to 12 mm and optimal socket density per burn-in board.
D Series H-Pin® Socket
Performance burn-in socket, with a clamshell-style lid that can be equipped with a heater and thermal sensor.
ES Series H-Pin® Socket
The modular lid construction can handle up to 1 kW of power and is optimized with thermal simulation to ensure out-of-the-box performance whether liquid or air cooled.
ES Micro Series H-Pin® Socket
Serving package sizes 20.0mm X 20.0mm (max) and pitch from 0.40mm – 0.65mm.
ESJ Series H-Pin Socket
High-performance burn-in socket, with dual latch clamshell lid to provide co-planar pressure on the DUT when the lid is actuated.
K Series H-Pin® Socket
This socket also uses the H-Pin contact technology providing wide RF performance capabilities and exceptional DC characteristics. The K-Series socket checks all the boxes: high frequency, high current, high temperature, low inductance, and Low loss.
M-Series H-Pin® Socket
The small outline footprint provides design flexibility and allows for high socket density on the burn-in board.
Q-Series H-Pin® Socket
Available for mid to large package sizes with a fully molded socket body and lid designed to meet the rigors of a wide variety of accelerated life testing applications.
These sockets offer a modular design in a small outline with very low inductance. Open Top QFN socket allows for more convenient package loading and unloading in most of the same lead count options as the lidded version.
R-Series H-Pin® Socket
Open-top reliability socket used for accelerated life testing. With versions of the compression mount open-top design available as a drop-in replacement for other legacy products on the market.