Smiths Interconnect offers Wafer Level Chip Scale Package (WLCSP) Probe Heads utilizing spring probe technology which provide high parallelism in test, superior signal integrity and high speed / RF testing capability.
In-house capabilities encompass design, development, manufacturing and testing. Providing operational excellence tailored to volume manufacturing requirements, global sourcing, world class engineering talent and rapid prototyping.
We foster a Culture of Quality to be the best at what we do ... Quality, it is all about the Customer.
Proprietary embedded barrel spring pin technology allows the best in class electrical and mechanical performance. Higher parallelism for greater throughput. Individually replaceable cartridge design allows minimal downtime. Optimized design of Fan out PCB to insure best signal integrity.
The Volta Series Probe Head addresses a need for reduced test time set-up and increased throughput in high reliability testing of Wafer Level Packages (WLP), Wafer Level Chip Scale Packages (WLCSP) and Known Good Die (KGD) at 180 µm pitch and higher.
Smiths Interconnect is a leading provider of technically differentiated electronic components, subsystems, microwave and radio frequency products that connect, protect and control critical applications in the commercial aviation, defense, space, medical, rail, semiconductor test, wireless telecommunications, and industrial markets.