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WLCSP Probe Heads

Smiths Interconnect offers Wafer Level Chip Scale Package (WLCSP) Probe Heads utilizing spring probe technology which provide high parallelism in test, superior signal integrity and high speed / RF testing capability.

WLCSP Probe Heads
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Quality

We foster a Culture of Quality to be the best at what we do ... Quality, it is all about the Customer.

Smiths Interconnect Capabilities

Capabilities

In-house capabilities encompass design, development, manufacturing and testing. Providing operational excellence tailored to volume manufacturing requirements, global sourcing, world class engineering talent and rapid prototyping.

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Kelvin Probes Solution

An innovative and robust spring probe technology for Kelvin contact applications down to 0.25mm pitch. The product’s unique chisel tip provides reliable, stable contact resistance for critical applications such as loT, Automotive where test performance cannot be sacrificed.

Volta Series Probe Head

The Volta Series Probe Head addresses a need for reduced test time set-up and increased throughput in high reliability testing of Wafer Level Packages (WLP), Wafer Level Chip Scale Packages (WLCSP) and Known Good Die (KGD) at 180 µm pitch and higher.

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Who We Are

Smiths Interconnect is a leading provider of technically differentiated electronic components, subsystems, microwave and radio frequency products that connect, protect and control critical applications in the commercial aviation, defense, space, medical, rail, semiconductor test, wireless telecommunications, and industrial markets.

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