Smiths Interconnect has consistently stood at the forefront of innovation, offering a wealth of knowledge and expertise to the Semiconductor industry for over 40 years. Browse through our repository of educational resources, including white papers, blogs, webinars, and literature. These resources not only showcase our deep understanding of complex technological challenges but also serve as valuable tools for industry professionals, seeking to expand their knowledge and stay abreast of the latest trends and developments.
This collection of case studies delves deep into the pivotal role played by Smiths Interconnect in the semiconductor sector. Through real-world examples, we illustrate how our advanced interconnect solutions, precision components, and state-of-the-art technology have not only met but exceeded the exacting demands of the semiconductor industry.
Increasing Digital Reliability
Smiths Interconnect’s Solution: Volta Series Probe Heads
Our product portfolio is meticulously designed to address these challenges, providing critical interconnect solutions and precision components that meet the exacting standards of the semiconductor test market. From high-frequency test sockets and customized test fixtures to advanced RF and microwave components, our offerings are engineered to support the reliable and precise testing of semiconductor devices.
Test socket and probe card solutions with spring probe contact technology to ensure superior quality and reliability in semiconductor test applications. Proven off-the-shelf and custom products deliver the best solutions for the customer’s specific requirements.
Area Array Test
Package On Package Test
Smart Phone CPU
NFC - Near Field Communications
Wafer Level Test
Peripheral Package Test
Proliferation of data devices and the growth of cloud computing, artificial intelligence and big data is resulting in complex systems and new materials that require rigorous, efficient validation. Smiths Interconnect’s test sockets and probe card solutions ensure superior quality and reliability in the semiconductor test applications. Our best-in-class engineering, development and technical expertise ensure support of automated, system level and development test platforms for area array, peripheral, wafer level and Package on Package (PoP) devices as well as high performance spring probe technology and cable assemblies.
Test SolutionsWe provide our customers with a competitive advantage when tackling the challenges of higher power, increased data rates, wider bandwidth, and greater connectivity all within a smaller footprint.
Smiths Interconnect expands into burn-in test market with acquisition of PlastronicsLearn More
Increasing Digital ReliabilityAs computers, mobiles and smart devices become more advanced, so must the integrated chips that support them. Smiths Interconnect’s new Volta semiconductor test solutions, are leading the way. These solutions are used for testing the integrated chip packages behind everything from Bluetooth and power management to digital displays. Volta significantly outperforms the competition in both durability and performance. Learn More
Whether for testing high performance computing, wearables or other automotive chips, Kepler is the only solution that provides two-axis of motion during a single actuation of the socket, an innovation set to pioneer the semiconductor test industry.
The distribution award initiative recognizes and celebrates the business partners whose efforts have contributed to advancing Smiths Interconnect’s business respectively in the Americas, EMEA and Asia. Winners were selected as best performing distributors in terms of sales growth compared to the previous year.
The acquisition broadens the company’s offering and strengthens its position in the semiconductor test market.