- High insertion life
- Suited for blind mate connections
- Low profile, high compliance ratio
- Ideal for high shock and vibration environments
Spring probe technology in custom connectors
Spring probe technology utilized in custom connector designs. Mixed signals and functionality can be designed into a single connector.
A High Performance, Cost-effective Alternative in Wafer Level Chip Scale Package Testing
The new Volta 180 Series is an advanced WLCSP test solution that expands Volta product line to include the compact 180um pitch, allowing for a higher number of chips to be tested on each wafer. It allows for a fast and reliable testing of wafers to ensure that they meet specifications and perform as they should, which translates into higher quality end products.
New Volta 200 Series Offers Easy Maintenance of Spring Probe Technology for Finest Pitch Wafer Test
Galileo is an innovative, low-profile test socket engineered to support today’s high performance Digital and RF applications. It leverages proven interposer elastomer technology and advanced 3D printing manufacturing to provide a high-performance solution for BGA, LGA, QFP, SOIC, or QFN packaged devices with extremely short lead times.