Chinese‑language webinar with DigiTimes Asia on next‑gen AI chip testing. Learn 2026+ trends, practical solutions for BGA/LGA, and join live Q&A with Smiths Interconnect experts.
This webinar explores the current requirements and future needs for successfully testing the reliability of next-generation AI Accelerator processor units.
Our expert will provide insights into the electrical and mechanical principles behind these sockets, explore test applications, and compare them to traditional probe sockets.
In this webinar we will discuss the challenges in designing and manufacturing an electro-mechanical interface for testing a Integrated Circuit running at 224 Gbps data rates. We will discuss the roadblocks in working in a fully simulated environment and our products that are capable of meeting next generation Integrated Circuit requirements.
The rapid expansion of connected devices and data-intensive applications is driving the growing demand for highly efficient and adaptive high-performance computing solutions. Mobile devices such as cell phones, tablets and car infotainment systems have the most sophisticated System-on-Chip (SoCs) ever produced.
Smiths Interconnect experts describe state-of-the art of Thermal Management Solutions applied to advanced digital processor IC devices. Special attention will be given to the emerging SiP and large BGA package challenges facing the industry.
