In this webinar we will discuss the challenges in designing and manufacturing an electro-mechanical interface for testing a Integrated Circuit running at 224 Gbps data rates. We will discuss the roadblocks in working in a fully simulated environment and our products that are capable of meeting next generation Integrated Circuit requirements.
The rapid expansion of connected devices and data-intensive applications is driving the growing demand for highly efficient and adaptive high-performance computing solutions. Mobile devices such as cell phones, tablets and car infotainment systems have the most sophisticated System-on-Chip (SoCs) ever produced.
Smiths Interconnect experts describe state-of-the art of Thermal Management Solutions applied to advanced digital processor IC devices. Special attention will be given to the emerging SiP and large BGA package challenges facing the industry.
