In collaboration with DigiTimes Asia

AI chip testing is evolving fast, and the combination of ultra‑large form factors and increasing performance demands is raising new challenges for test engineers across the region. On 21 May, Smiths Interconnect is teaming up with DigiTimes Asia for a Chinese‑language live webinar specifically targeting the ROA region, focused on the core challenges and advanced solutions shaping next‑generation AI chip testing.

In this live session, our experts Andy Huang and Hunter Weng will introduce flagship innovations - including the latest DaVinci™ Gen V test socket - and break down how our technology is addressing the growing complexity of AI chip test requirements.

Key Takeaways:

If your work involves AI chips, high-performance computing, data center hardware, or semiconductor test technologies, this webinar will provide:

• Cutting‑edge insights: Understand AI chip testing trends for 2026 and beyond. 
• Real‑world solutions: Practical guidance for testing ultra‑large form factor packages such as BGA and LGA. 
• Live Q&A: Interact directly with Smiths Interconnect experts to discuss your specific testing challenges.

Speakers:

Andy Huang & Hunter Wong: Semiconductor Test Field Application Engineers, Smiths Interconnect