Array High Speed Test - DaVinci Micro Test Socket

Impedance Controlled Coaxial Solution for High Speed Test

The rapid expansion of connected devices and data-intensive applications are driving the growing demand for highly efficient and adaptive high-performance computing solutions. Whether it’s a complex SoC for a mobile phone or gaming system, volatile memory or an automotive radar application, the core functions and performance requirements all are being manufactured in the smallest possible footprint. The need to add more functionality in the smallest possible size has led to a reduction in IC pitch to less than 500 μm. At the same time, the increased performances in system-on-chip affect pin-to-pin noise or what is often called crosstalk during testing.

DaVinci Micro fully shielded signal path negates the effects of cross-talk during test, allowing an immediate yield enhancement over non-DaVinci products.

Technical Specification
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Features

Spring probe technology using homogenous alloy
Short signal path 2.85 mm Test Height
Impedance tuning, can match system or defined as needed, 40, 45, 50 Ohm impedance (single ended)
Cross-talk suppression IM housing
Tri-temp socket design to support -40 °C to +125 °C
Consistent stable contact resistance 120 mΩ (Ave)
Designed for manual test, bench test, and HVM Production Test using the same socket
Solution for BGA, LGA, QFN, DFN, and other variants, ideal for minimum pitch 0.35 mm
Floating base or Hi Low configuration to protect spring probes during use

Benefits

Tested to 500K
Short contact path for excellent DC performance
RF Bandwidth up to 30 GHz @ -1dB IL
Reduction in pin-to-pin noise (cross-talk)
Precision-machined socket housing ensures robust mechanical performance
Field repairable, replace a single probe or full array without the need for additional training
Patented Insulated Metal socket housing for optimal signal integrity performance and strength
Match existing PCB socket footprint and test hardware led to cost-saving for customers

Array High Speed Test - DaVinci Series

Innovative IM material to permit a truly coaxial structure from tip to tip allowing for industry leading yields in a highly compliant contactor.

Smiths Interconnect expands DaVinci test socket offering

The request for increased functionality in the smallest possible footprint has led to a reduction of the pitch of integrated circuits below 500 μm. At the same time, increased performances in SoCs affect pin-to-pin noise or what is commonly called crosstalk during testing.
Smiths Interconnect expands into burn-in test market with acquisition of Plastronics

The acquisition broadens the company’s offering and strengthens its position in the semiconductor test market.
Challenges for Test Sockets Running at 224 Gbps Data Rates

In this webinar we will discuss the challenges in designing and manufacturing an electro-mechanical interface for testing a Integrated Circuit running at 224 Gbps data rates. We will discuss the roadblocks in working in a fully simulated environment and our products that are capable of meeting next generation Integrated Circuit requirements.
Is it really that hard to improve chip test performance?

In the digital era, semiconductor chips are present in almost every aspect of our lives. Whether it is from microwave ovens to computers, cell phones, computer central processing units, and other electronic devices there are a variety of chips installed.

Array High Speed Test - DaVinci Micro Test Socket

Features & Benefits

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Related Products

Array High Speed Test - DaVinci Series

Related News

Smiths Interconnect expands DaVinci test socket offering

Smiths Interconnect expands into burn-in test market with acquisition of Plastronics

Challenges for Test Sockets Running at 224 Gbps Data Rates

Is it really that hard to improve chip test performance?

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