Features
- Spring probe technology using homogenous alloy
- Short signal path 2.85 mm Test Height
- Impedance tuning, can match system or defined as needed, 40, 45, 50 Ohm impedance (single ended)
- Cross-talk suppression IM housing
- Tri-temp socket design to support -40 °C to +125 °C
- Consistent stable contact resistance 120 mΩ (Ave)
- Designed for manual test, bench test, and HVM Production Test using the same socket
- Solution for BGA, LGA, QFN, DFN, and other variants, ideal for minimum pitch 0.35 mm
- Floating base or Hi Low configuration to protect spring probes during use
Benefits
- Tested to 500K
- Short contact path for excellent DC performance
- RF Bandwidth up to 30 GHz @ -1dB IL
- Reduction in pin-to-pin noise (cross-talk)
- Precision-machined socket housing ensures robust mechanical performance
- Field repairable, replace a single probe or full array without the need for additional training
- Patented Insulated Metal socket housing for optimal signal integrity performance and strength
- Match existing PCB socket footprint and test hardware led to cost-saving for customers
