Features & BenefitsFeatures Spring probe technology using homogenous alloy Short signal path 2.85 mm Test Height Impedance tuning, can match system or defined as needed, 40, 45, 50 Ohm impedance (single ended) Cross-talk suppression IM housing Tri-temp socket design to support -40 °C to +125 °C Consistent stable contact resistance 120 mΩ (Ave) Designed for manual test, bench test, and HVM Production Test using the same socket Solution for BGA, LGA, QFN, DFN, and other variants, ideal for minimum pitch 0.35 mm Floating base or Hi Low configuration to protect spring probes during use Benefits Tested to 500K Short contact path for excellent DC performance RF Bandwidth up to 30 GHz @ -1dB IL Reduction in pin-to-pin noise (cross-talk) Precision-machined socket housing ensures robust mechanical performance Field repairable, replace a single probe or full array without the need for additional training Patented Insulated Metal socket housing for optimal signal integrity performance and strength Match existing PCB socket footprint and test hardware led to cost-saving for customers
Documents & Literature BrochureArticleDaVinci Micro Brochure (US)698 kBDaVinci Micro Brochure (A4)698 kBEvolution of impedance-controlled coaxial test sockets and IM material application3416 kBA paradigm shift in simulation techniques of semiconductor test sockets5189 kB