Product Features
- Solution for BGA, LGA and other variants
- Spring probe technology using homogenous alloy gold plated
- RF Bandwidth > 40 Ghz @ -1dB IL
- Short signal path 4.90 mm test height
- 43, 50 Ohm impedance (single-ended)
- Consistent stable contact resistance 80 mΩ (Ave)
- Hi-Coplanarity accommodation
- Tri-Temp socket design to support -55 °C to +125 °C
- Designed for manual test, bench test, and HVM production test using the same socket
Benefits
- Design adaptation to meet the requirement
- Long contact life, tested to 500K insertions
- Impedance can match the system or be defined as needed
- Excellent DC performance
- Patented Insulated Metal socket housing for optimal signal integrity performance and strength
- Precision-machined socket housing ensures robust mechanical performance
- Field repairable, replace a single probe or full array
- Cleaning can be done online with a cleaning surrogate
- Match existing PCB socket footprint and test hardware lead to cost saving for customers
- Winner of the Best Test Measurement Award of the Year at the Global Electronics Achievement Awards (GEAA).
- Winner of the IET Excellence & Innovation Award in the Emerging Technology of the Year category.
- Shortlisted as a top product in Test & Measurement for the 2024 World Electronics Achievement Awards by AspenCore.
- Finalist in the 2024 British Business Awards for Innovation and Sustainability.
