Array High Speed Test - DaVinci 112

Impedance Controlled Coaxial Solution for High Speed Test

The DaVinci 112 test socket extends the 'DaVinci’ Series with an innovative solution for testing the most complex functionality of ASICs (Application Specific Integrated Circuits). Testing these devices at full functionality is challenging. With hundreds of PAM-4 signals, the ability to isolate pin-to-pin cross-talk at the fundamental frequency below -40dB becomes critical. DaVinci 112 increases production yields and throughput, eliminating false faults and complete functional failures.

Technical Specification
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Product Features

Solution for BGA, LGA and other variants
Spring probe technology using homogenous alloy gold plated
RF Bandwidth > 40 Ghz @ -1dB IL
Short signal path 4.90 mm test height
43, 50 Ohm impedance (single-ended)
Consistent stable contact resistance 80 mΩ (Ave)
Hi-Coplanarity accommodation
Tri-Temp socket design to support -55 °C to +125 °C
Designed for manual test, bench test, and HVM production test using the same socket

Benefits

Design adaptation to meet the requirement
Long contact life, tested to 500K insertions
Impedance can match the system or be defined as needed
Excellent DC performance
Patented Insulated Metal socket housing for optimal signal integrity performance and strength
Precision-machined socket housing ensures robust mechanical performance
Field repairable, replace a single probe or full array
Cleaning can be done online with a cleaning surrogate
Match existing PCB socket footprint and test hardware lead to cost saving for customers

Smiths Interconnect expands DaVinci test socket offering

The request for increased functionality in the smallest possible footprint has led to a reduction of the pitch of integrated circuits below 500 μm. At the same time, increased performances in SoCs affect pin-to-pin noise or what is commonly called crosstalk during testing.
Introducing the next generation of high-speed test solutions

Smiths Interconnect announces the expansion of its DaVinci Series to incorporate DaVinci 112 - ideal for testing some of the most complex functionality of Application Specific Integrated Circuits (‘ASICs’).
Smiths Interconnect expands into burn-in test market with acquisition of Plastronics

The acquisition broadens the company’s offering and strengthens its position in the semiconductor test market.
Integrated test solutions for 5G, data centers, and high-speed test applications

The rapid expansion of connected devices and data-intensive applications is driving the growing demand for highly efficient and adaptive high-performance computing solutions. Mobile devices such as cell phones, tablets and car infotainment systems have the most sophisticated System-on-Chip (SoCs) ever produced.

Array High Speed Test - DaVinci 112

Features & Benefits

Documents & Literature

Related News

Smiths Interconnect expands DaVinci test socket offering

Introducing the next generation of high-speed test solutions

Smiths Interconnect expands into burn-in test market with acquisition of Plastronics

Integrated test solutions for 5G, data centers, and high-speed test applications

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