Advantages and Challenges of Planar Thin Film Bandpass Technology in RF Applications Commercial AerospaceRF FiltersSpaceDefense Monday, July 11th On Demand Register Overview Applications in the X, Ku and Ka bands require smaller size and weight components while providing high electrical response performance. In this webinar, Smiths Interconnect experts will address the advantages and challenges of RF filters that have reduced size and weight but also provide minimal loss in the passband and maximum rejection in the stopbands. To choose the right RF filter for your next RF design requires understanding the filter's size, weight and performance. Special attention will be given to the planar chip thin film bandpass filter technology, ideal for SATCOM, radar and broadcasting industry. The small footprint, lightweight and surface mount configuration allow for high volume, pick and place applications within mission-critical defense and space industries. Key Takeaways Understand the advantages for applications in the X, Ku, and Ka frequency bands. Discover the key challenges of optimizing filter capabilities while reducing size. Choose the right thin film technology solutions in K and Ka frequency bands. Presented By Mike Schweyer Product Line Manager, Filters and Integrated Filter Assemblies Mike is the Product Line Manager for Filters and Integrated Filter Assemblies for Smiths Interconnect. Mike is responsible for interpreting all key market trends, developing strategies, and providing direction into product roadmap and strategy and penetration into key and target accounts. Mike earned a BS and an ME degree in Electrical Engineering from University of Maine. He has over 26 years of industry experience in RF and Microwave technology including product design, product management, manufacturing and test. Sean Adams RF Engineer Sean is an RF Engineer at Smiths Interconnect. With more than 16 years of RF experience, he has extensive knowledge in RF testing, design, production, and process control. His expertise lies in coaxial cavity, printed circuit board, waveguide, and dielectric resonator filters. Sean has been with Smiths Interconnect for almost four years. Monday, July 11th On Demand Register Share this article Share on Facebook Share on Twitter Share on LinkedIn Share via Email
Mike Schweyer Product Line Manager, Filters and Integrated Filter Assemblies Mike is the Product Line Manager for Filters and Integrated Filter Assemblies for Smiths Interconnect. Mike is responsible for interpreting all key market trends, developing strategies, and providing direction into product roadmap and strategy and penetration into key and target accounts. Mike earned a BS and an ME degree in Electrical Engineering from University of Maine. He has over 26 years of industry experience in RF and Microwave technology including product design, product management, manufacturing and test.
Sean Adams RF Engineer Sean is an RF Engineer at Smiths Interconnect. With more than 16 years of RF experience, he has extensive knowledge in RF testing, design, production, and process control. His expertise lies in coaxial cavity, printed circuit board, waveguide, and dielectric resonator filters. Sean has been with Smiths Interconnect for almost four years.