This webinar will address customer’s needs for RF board level devices and components requiring temperature compensation that increases product performance & adds reliability for their mission critical applications and programs.
The objective of this webinar is to share the concept of RF filter-based passive multi-function assemblies (MFA). Examples are provided that incorporate such functions as transitions, RF filters, ferrite isolators, non-directional couplers and high-power terminations that illustrate the advantages and the pitfalls that can readily be avoided.
This webinar will focus on Smiths Interconnects' newly space qualified KVPX Backplane Connector. KVPX connectors are qualified to EEE-INST-002 Level 1 and are equipped with Hypertac® space-qualified 0.4 mm hyperboloid sockets and provide immunity to shock and vibration fretting, numerous linear paths of contact, low-forces, high mating cycles, and a self-wiping cleaning action that results in consistently better integrity in extreme environments.
This webinar will focus on common contact technologies used in the connector industry and how to avoid fretting corrosion by implementing Hypertac® hyperboloid contact technology in your connector designs. This contact technology offers proven benefits and our engineering teams over the years continue to creatively adapt the concept to meet the needs of so many diverse applications.
The objective of this webinar is to share the concept of passive multi-function assemblies (MFAs), with examples provided that incorporate such functions as transitions, RF filters, ferrite isolators, non-directional couplers and high-power terminations. It will illustrate the advantages and the pitfalls that can readily be avoided and will offer an understanding of the trade-offs and benefits of MFAs in the defense and space industries.
The shift in market trends from GEO to LEO and large satellites to constellation systems have introduced several changes to environmental and reliability requirements. This webinar will address the way these changes affect qualifications, lot acceptance tests, and reliability standards related to cable assemblies designed for new space applications.
This webinar will address customer’s adaptation of the current industry qualifications standards, product specifications and environmental factors for proper design and development of RF board level devices and components for new space and defense applications. The focus will be MIL-PRF-55342 and other military standards for passive RF component reliability, reducing lead time and cost of ownership.
Applications in the X, Ku and Ka bands require smaller size and weight components while providing high electrical response performance. In this webinar, Smiths Interconnect experts will address the advantages and challenges of RF filters that have reduced size and weight but also provide minimal loss in the passband and maximum rejection in the stopbands.
Solid state power amplifiers (SSPA) have been with us for decades. With each new generation of transistors and FETs SSPAs have extended their effective operating frequency and bandwidth, RF power and efficiency. As the years and technology have progressed, ferrite isolators, and in some cases circulators, have continued to provide a cost-effective solution to buffer the gain stages and protect the SSPA from reflected power.
This webinar will describe why optic communications in space are a key element of the success of new global connectivity networks. From intra-satellite to inter-satellite high speed links, optical communication over fiber optics or over optical wireless terminals can help by extracting the most from the communication architectures while offering low SWaP.
In this webinar, Smiths Interconnect experts will examine the different RF filter technologies, evaluate key parameters when choosing an RF filter, and discuss current and future RF filter trends. Special attention will be given to the emerging planar chip filter and thick, and thin film processing technology.
Learn from our industry experts as they share RF cable assembly challenges focused on radiation harden materials, cable routing, cable modularity, shielding effectiveness and lowering cost of ownership.
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