24 Results
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Kelvin Probes Solution
Unique chisel tip provides reliable, stable contact resistance for critical applications such as loT, automotive where test performance cannot be sacrificed.
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Array High Speed Test - DaVinci 112
DaVinci 112 increases production yields and throughput, eliminating false faults and complete functional failures.
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H-Pin®
A stamped spring probe with the mechanical, electrical, and thermal performance of a spring probe, and the ease of use and high volume manufacturability of a stamped contact.
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C-Series H-Pin® Socket
Modular burn-in socket with clamshell-style lid. Range of package accommodations, from 0.5 mm body size up to 12 mm and optimal socket density per burn-in board.
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Volta Series Probe Head
High performance, cost-effective, easily maintainable alternative to cantilever and vertical probe card technologies.
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Array High Speed Test - DaVinci Micro Test Socket
Fully shielded signal path negates the effects of cross-talk during test, allowing an immediate yield enhancement.
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D Series H-Pin® Socket
Performance burn-in socket, with a clamshell-style lid that can be equipped with a heater and thermal sensor.
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Array High Speed Test - DaVinci Series
Innovative IM material to permit a truly coaxial structure from tip to tip allowing for industry leading yields in a highly compliant contactor.
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ES Series H-Pin® Socket
The modular lid construction can handle up to 1 kW of power and is optimized with thermal simulation to ensure out-of-the-box performance whether liquid or air cooled.Â
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Array PoP Test
Designed with the benefit of a variety of verification tools to ensure simultaneous engagement and alignment to both sides of the package.
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ES Micro Series H-Pin® Socket
Serving package sizes 20.0mm X 20.0mm (max) and pitch from 0.40mm – 0.65mm.
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Galileo Test Socket
Innovative, low-profile test socket that provides outstanding electrical and mechanical performance for IC test customers who need a cost effective, rapid delivery solution.