Skip to content
Login Register

KuStream® 1000

The KuStream®1000 fuselage mount antenna system featuring TECOM technology offers gate-to-gate SATCOM In-Flight Connectivity on global Ku-band networks and new HTS Satellites.

Download Brochure

Features & Benefits

The KuStream® 1000 fuselage mount antenna system featuring TECOM technology is a complete SATCOM terminal solution featuring a high gain fuselage mount multi-gimbal antenna, high power transceiver (25W), antenna control unit and a customer specified modem to offer maximum network flexibility. The KuStream® 1000 is installed on over 1000 aircraft, has logged over 15 million hours flight hours and servers millions of customers worldwide.

Contact our product experts to discuss your specific system requirements and custom configurations to meet your needs.

Integrated 4 LRU system

  • Satellite Antenna Assembly (SAA)
  • Antenna Control Unit (ACU)
  • High Power Transceiver (HPT)
  • Modem agnostic (customer selected)

Large Install Base

  • Over 1000 aircraft installations
  • More than 15 million flight hours
  • Commercial and military variants

Market leader

  • Full Ku-band spectrum coverage for military and commercial use
  • Full compliance with stringent FCC regulatory standards
  • Gate-to-gate connectivity
  • Operates on global Ku-band networks and new HTS satellites

Documents & Literature

Related Products

  • Image of Up/Down Frequency Converters

    Up/Down Frequency Converters

    High performance frequency block upconverters, and block downconverters are specifically designed for airborne satellite communications, data links, point to point radio links, and radar applications

Related News

  • Image of in-flight connectivity

    Antenna innovation delivers high-speed in-flight broadband

    Smiths Interconnect's KuStream™ technology, a network agnostic Ku broadband antenna system avoids the typical in-flight Wi-Fi Blackout below 10,000 feet due to its industry-leading geographical skew angle range and precision horn array aperture design with integrated feeding network.

  • Image of Challenges Semiconductor Package Size and Pitch Face in Shrinking Consumer Electronics

    BGA Sockets To Solve All Your Electronics Testing Needs

    Plastronics, a Smiths Interconnect technology brand, is a global provider of innovation for semiconductor reliability testing, meeting the industry’s burn-in socket needs for more than 40 years. It all started when our company invented the first open-top, application-specific socket for production burn-in of LCC packages. This innovation helped semiconductor manufacturers significantly increase their throughput and decrease costs.