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H-Pin®

Stamped Contact

The H-Pin is a stamped spring probe with the mechanical, electrical, and thermal performance of a spring probe, and the ease of use and high volume manufacturability of a stamped contact. The H-Pin serves applications without the typical compromises that are generally required when considering cost versus performance.

Brochure

Features & Benefits

  • Compliancy for large package warpage
  • Stable contact resistance and force
  • Solid beam electrical performance
  • Compliancy at high temperatures (200°C)
  • Correlated bi, system evaluation and test
  • Reliable power and ground contact
  • Stocked inventory and better lead time
  • High volume capacity, quality control, and ease of use

Feature Options

  • 0.40 mm to 0.70 mm travel
  • Flat-spring rate
  • BeCu H-Pin
  • Stainless steel core spring
  • Bandwidth –1dB @ 15 GHz
  • Current carrying capacity
  • High-volume stamping
  • Reel-to-reel pin insertion

Overview

Excellent mechanical and electrical performance.
Utilizing high volume BeCu stamping technology, combined with a stainless steel spring for mechanical travel, the H-Pin has a working range up to 0.70 mm with a flat spring rate and can be utilized up to 15 GHz with –1.0 dB loss, carry up to 4 A of current and withstand temperatures up to 200 °C.

High volume stamping and quality control.
From pin one to one million, you’ll get the same pin every time. Because of our automated H-Pin manufacturing process, you’ll be the first person to make contact with your pins.

Documents & Literature

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