25 Results
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Thermal Management Lid Capabilities
Thermal Management Lid solutions are high value variations, including air-chilled or liquid cooled technology, capable of dissipating up to 650 Watts.
Smiths Interconnect’s test socket and probe card solutions utilize IDI contact technology to ensure superior quality and reliability in semiconductor test applications. Our best-in-class engineering, development and technical expertise ensure support of automated, system level and development test platforms.
25 Results
Thermal Management Lid solutions are high value variations, including air-chilled or liquid cooled technology, capable of dissipating up to 650 Watts.