Features & BenefitsFeatures Using state of the art simulation capabilities, the design is optimized to achieve efficient heat dissipation Compact, table-top chiller unit Compatible with conventional socket and lid mounting design footprints Utilizes air or liquid cooling mediums Customizable hose connector Optional air purge features Benefits Stabilizes junction temperature within desired range allowing IC package testing at higher thermal power point for a longer duration ensuring a more accurate test Small size takes less space in test lab Increased test efficiency and accuracy provides greater throughput Compatible with existing test hardware, coolant mediums and air inlets, reducing overall cost of test
OverviewAs next generation logic IC packages, network processors [NP], central processing units [CPU] and graphic processing units [GPU] become more powerful the amount of heat they generate increases exponentially. Thermal management is a challenge all device manufacturers and test houses must overcome. Smiths Interconnect’s Thermal Management Lid solutions are high value options, including air-chilled or liquid cooled technology, capable of dissipating up to 650 Watts. We develop our solutions to be compatible with existing test hardware footprints for simple integration, reducing test set-up time and overall cost. The off-the-shelf chiller unit is compact and uses very little space within the test lab. Smiths Interconnect’s design team utilizes extensive system simulation models throughout product development to ensure an optimal solution for the specific test environment. Smiths Interconnect Thermal Management Solutions Include: Finned Heatsink Liquid Cooled Heatsink Heatpipe | Heatsink Hi-Perform LC with Chiller (with optional Purge)
New Cooling Solutions Hi-Perform Liquid Cooled Hi-Perform LC Lid options to be used with a chiller: High Performance Liquid Cooled Lid (350W to 500W @ 85°C Case Temperature) High Performance Liquid Cooled Lid with Purge (350W to 500W @ 60°C or lower Case Temperature) There is an option to use a chiller with either style Heatpipe | Heatsink Lid 350W @ 85°C Case Temperature Dissipated Power (W) at 85°C Case Temp Lid Types Finned Heatsink with Fan Liquid Cooled Heatsink Heatpipe Heatsink Hi-Perform LC w/ Chiller 6-50W Families 3-7 X 51-100W Families 5-7 X 101-160W ≥ Families 7 or CAM X X 161-200W ≥ Families 7 or CAM X X 201-350W ≥ Families 7 or CAM X X 201-350W ≥ Families 8 or CAM X X 351-650W ≥ Families 7 or CAM X