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Thermal Management Lid Capabilities

IC Test Solutions

Smiths Interconnect offers high value Thermal Management Lid capabilities including air-chilled or liquid cooled technology, capable of dissipating up to 650 Watts.  Our solutions are developed to be compatible with existing test hardware footprints for simple integration, reducing test set-up time and overall cost.

Features & Benefits

Features

  • Using state of the art simulation capabilities, the design is optimized to achieve efficient heat dissipation
  • Compact, table-top chiller unit
  • Compatible with conventional socket and lid mounting design footprints
  • Utilizes air or liquid cooling mediums
  • Customizable hose connector
  • Optional air purge features

Benefits

  • Stabilizes junction temperature within desired range allowing IC package testing at higher thermal power point for a longer duration ensuring a more accurate test
  • Small size takes less space in  test lab
  • Increased test efficiency and accuracy provides greater throughput
  • Compatible with existing test hardware, coolant mediums and air inlets, reducing overall cost of test

 

Overview

As next generation logic IC packages, network processors [NP], central processing units [CPU] and graphic processing units [GPU] become more powerful the amount of heat they generate increases exponentially.  Thermal management is a challenge all device manufacturers and test houses must overcome.

Smiths Interconnect’s Thermal Management Lid solutions are high value options, including air-chilled or liquid cooled technology, capable of dissipating up to 650 Watts. We develop our solutions to be compatible with existing test hardware footprints for simple integration, reducing test set-up time and overall cost.  The off-the-shelf chiller unit is compact and uses very little space within the test lab.

Smiths Interconnect’s design team utilizes extensive system simulation models throughout product development to ensure an optimal solution for the specific test environment.

Smiths Interconnect Thermal Management Solutions Include:

  • Finned Heatsink
  • Liquid Cooled Heatsink
  • Heatpipe | Heatsink
  • Hi-Perform LC with Chiller (with optional Purge)

New Cooling Solutions

Hi-Perform Liquid Cooled

Hi-Perform Liquid Cooled

Hi-Perform LC Lid options to be used with a chiller:

  •  High Performance Liquid Cooled Lid (350W to 500W @ 85°C Case Temperature)
  • High Performance Liquid Cooled Lid with Purge (350W to 500W @ 60°C or lower Case Temperature)
  • There is an option to use a chiller with either style
Heatpipe | Heatsink Lid

Heatpipe | Heatsink Lid

 350W @ 85°C Case Temperature

Dissipated Power (W)
at 85°C Case Temp

Lid Types

Finned Heatsink
with Fan

Liquid Cooled
Heatsink

Heatpipe
Heatsink

Hi-Perform
LC
w/ Chiller

6-50W

Families 3-7

X

 

 

 

51-100W

Families 5-7

X

 

 

 

101-160W

≥ Families 7 or CAM

X

X

 

 

161-200W

≥ Families 7 or CAM

X

X

 

 

201-350W

≥ Families 7 or CAM

 

X

 

X

201-350W

≥ Families 8 or CAM

 

 

X

X

351-650W

≥ Families 7 or CAM

 

 

 

X

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