About ASPS

With the recent entry into the era of AI, the demand for semiconductors capable of handling the explosive growth in data has significantly increased. As a result, the importance of advancing semiconductor packaging technologies, such as chiplet and hybrid bonding—core technologies—is growing day by day.

In response, we will host the Advanced Semiconductor Packaging & Chiplet Show, a B2B event to showcase the latest semiconductor packaging and processing technologies to global IDM, OSAT, AI&ICT, computing, automotive, and electronics manufacturers.

ASPS 2025 Brochure download

The Venue

Suwon Convention Center is a pivotal location for the electronics and semiconductor industry, offering a shorter commute for the visitors.

Opening Days

Day 1 : August 27, 2025 | 10:00-17:00

Day 2 : August 28, 2025 | 10:00-17:00

Day 3 : August 29, 2025 | 10:00-16:30

Exhibits

Semiconductor Packaging Test & Processing Equipment

Semiconductor Packaging Materials & Parts

Semiconductor Packaging Technical Solutions & EDA Software

Semiconductor Glass Substrate & Processing Materials, Equipment

Other Wafer Processing Materials, Parts, and Equipment

Concurrent Events

Day 1. Semiconductor Packaging Trend Forum (SPTF)

Day 1-2. Int'l Semiconductor Executive Summits(ISES Korea)

Day 1-2. Seminar by Korea Packaging Integration Assosiation (KPIA)

Day 2. Symposium by SBJ

Day 1-3. Exhibitor Tech Seminar